Ni-Y Internal Electrodes for Uniform Thin Multilayer Capacitors

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for forming internal electrodes in multilayer ceramic capacitors face challenges in ensuring uniform thickness and connectivity, leading to disconnected regions and reduced insulation resistance and withstand voltage properties.

Innovation Solution

Incorporating nickel (Ni) and yttrium (Y) into the internal electrodes, with a thickness of 50 nm to 250 nm, to delay sintering and improve connectivity and thickness uniformity, while using thin film deposition methods like sputtering or chemical vapor deposition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If internal electrodes are thinned to achieve miniaturization and high capacitance, then productivity and capacitance density are improved, but manufacturing precision deteriorates due to difficulty in ensuring uniform thickness and connectivity

Engineering Contradiction:

Improvecapacitance densityVSAvoidthickness uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent changes the material composition parameter of the internal electrode by incorporating yttrium (Y) into the nickel-based conductive paste. This compositional parameter change enables the electrode to maintain uniform thickness and connectivity even at reduced thicknesses of 50 nm to 250 nm, resolving the manufacturing precision issue while preserving the productivity benefits of thinning.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite material system consisting of nickel (Ni) and yttrium (Y) in the internal electrode. This composite structure combines the high conductivity of nickel with the sintering-delaying properties of yttrium, achieving both uniform thickness distribution and connectivity at thin dimensions that would be impossible with conventional single-material electrodes.

Inventive Principle:

Principle #40Composite materials

2Volume of moving object

If internal electrodes are thinned for miniaturization, then device size is reduced, but reliability deteriorates due to disconnected regions forming during stacking and sintering processes

Engineering Contradiction:

Improvecomponent sizeVSAvoidelectrode connectivity

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

Yttrium acts as an intermediary element in the internal electrode structure. It mediates between the nickel particles, preventing direct contact and over-sintering that would cause connectivity loss. This intermediary作用 maintains electrode continuity and reliability even when the overall electrode thickness is reduced for miniaturization.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies preliminary anti-action by incorporating yttrium to preemptively prevent the formation of disconnected regions during the stacking and sintering processes. The yttrium creates a protective effect before connectivity issues can arise, ensuring reliable electrode connections throughout the manufacturing process despite reduced electrode thickness.

Inventive Principle:

Principle #9Preliminary anti-action

3Ease of manufacture

If conventional conductive paste is used for internal electrodes, then ease of manufacture is maintained, but manufacturing precision deteriorates due to inability to ensure uniform thickness

Engineering Contradiction:

Improvepaste application processVSAvoidthickness uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent modifies the compositional parameters of the conductive paste by adding yttrium to the conventional nickel-based formulation. This parameter change maintains the ease of paste application and printing while dramatically improving thickness uniformity, as the yttrium content (greater than in the dielectric layer) ensures consistent electrode formation during the manufacturing process.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances insulation resistance and withstand voltage properties by ensuring consistent electrode thickness and connectivity, facilitating miniaturization and high capacitance in multilayer electronic components.

Implementation Method 1

Incorporating nickel (Ni) and yttrium (Y) into the internal electrodes, with a thickness of 50 nm to 250 nm, to delay sintering and improve connectivity and thickness uniformity

Methodology Applied

Scientific EffectSintering delay: Sintering

Implementation Method 2

using thin film deposition methods like sputtering or chemical vapor deposition

Methodology Applied

Scientific EffectSputtering: Sputtering

Implementation Method 3

using thin film deposition methods like sputtering or chemical vapor deposition

Methodology Applied

Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS12451288B2Multilayer electronic component

Publication Date: 2025.10.21 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer, and an external electrode disposed on the body. The internal electrode includes nickel (Ni) and yttrium (Y), and an average thickness of the internal electrode is 50 nm or more to 250 nm or less.