Nickel-Tin Alloy Layer for Electronic Component Adhesion

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Solution Overview

Problem

Existing electronic components face delamination issues when subjected to excessive stress, particularly due to the lack of a stable interface between the nickel layer and the base electrodes, leading to failure in adhesion.

Innovation Solution

An electronic component structure is introduced, where a nickel-tin alloy layer is deposited between the base electrode and the nickel layer, enhancing adhesion by interposing the alloy layer, which is composed of Ni3Sn with a nickel-to-tin molar ratio of 2.5 to 3.5, thereby preventing delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a nickel layer is deposited directly on the base electrode, then the structure is simple, but delamination occurs under stress

Engineering Contradiction:

Improvestructure simplicityVSAvoidadhesion stability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

An alloy layer containing nickel and tin is introduced as an intermediary between the base electrode and the nickel layer. This intermediate layer improves adhesion stability by creating a gradient transition in material properties, preventing direct contact between the base electrode and nickel layer that would otherwise cause delamination under stress.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses a composite structure consisting of multiple layers: base electrode, alloy layer (nickel-tin), and nickel layer. This composite material approach combines the benefits of each layer while mitigating their individual weaknesses, achieving both structural simplicity and adhesion stability.

Inventive Principle:

Principle #40Composite materials

2Reliability

If an alloy layer is added between the base electrode and nickel layer, then adhesion is improved, but the structure becomes more complex

Engineering Contradiction:

Improveadhesion stabilityVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The alloy layer is applied locally at the critical interface between the base electrode and nickel layer, where adhesion is most needed. This localized approach improves adhesion stability without unnecessarily complicating the entire structure, as the alloy layer is confined to a specific region rather than being distributed throughout.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The interposed alloy layer significantly reduces delamination failure, ensuring the nickel layer adheres properly to the base electrode, maintaining structural integrity under stress conditions and improving solder wettability.

Implementation Method 1

an alloy layer deposited on the surface of the base electrode; and a nickel layer deposited on a surface of the alloy layer

Methodology Applied

Scientific EffectElectroplating: Electroplating

Implementation Method 2

since the adhesion between the alloy layer and the base electrode and the adhesion between the alloy layer and the nickel layer are reasonably high, delamination can be prevented

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11551865B2Electronic component

Publication Date: 2023.01.10 MURATA MFG CO LTD

AI summary

An electronic component includes a component body, a base electrode that has a surface exposed from the component body and contains at least one of silver and copper, an alloy layer deposited on the surface of the base electrode, and a nickel layer deposited on a surface of the alloy layer. The material of the alloy layer is an alloy containing nickel and tin.