Nitride Semiconductor Dislocation Control via Nanocomposite Layers

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Solution Overview

Problem

Current methods for growing nitride semiconductor layers on heterogeneous substrates often result in dislocation defects due to lattice constant and thermal expansion coefficient inconsistencies, leading to reduced device efficiency and reliability, particularly in light-emitting diodes.

Innovation Solution

A dislocation control layer composed of nanocomposites, such as SiO2 and GaN or β-Ga2O3 nanoparticles, is used to mitigate these defects by forming a uniform distribution on the substrate, allowing for high-quality epitaxial growth of nitride semiconductor layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a nitride semiconductor layer is grown on a heterogeneous substrate, then device manufacturing is enabled, but dislocation defects occur due to lattice constant inconsistency and thermal expansion coefficient difference

Engineering Contradiction:
Improvedevice manufacturingVSAvoiddislocation defects
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A dislocation control layer is introduced as an intermediary between the heterogeneous substrate and the nitride semiconductor layer. This intermediate layer mediates the lattice mismatch and thermal expansion differences, enabling device manufacturing while preventing dislocation defects from propagating into the active semiconductor region.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The dislocation control layer utilizes composite material structures with specific compositions designed to bridge the mechanical and thermal property gaps between the substrate and nitride semiconductor. The composite nature of this layer allows it to accommodate both lattice constant inconsistency and thermal expansion coefficient differences.

Inventive Principle:
Principle #40Composite materials

2Device complexity

If conventional substrate growth methods are used, then manufacturing simplicity is maintained, but internal quantum efficiency is reduced due to physical damage and dislocations

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidinternal quantum efficiency
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The dislocation control layer is formed in advance before growing the nitride semiconductor layer. This preliminary action prevents physical damage and dislocation propagation at the source, thereby maintaining internal quantum efficiency without adding significant complexity to the manufacturing process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the growth of high-quality nitride thin films with improved internal quantum efficiency and reduced physical damage, enhancing the reliability and efficiency of nitride semiconductor light-emitting devices.

Implementation Method 1

dislocation defects due to lattice constant and thermal expansion coefficient inconsistencies

Methodology Applied
Scientific EffectLattice mismatch:

Implementation Method 2

dislocation defects due to lattice constant and thermal expansion coefficient inconsistencies

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

allowing for high-quality epitaxial growth of nitride semiconductor layers

Methodology Applied
Scientific EffectEpitaxial growth: Epitaxy

Data Source

PatentUS9053955B2Nitride semiconductor device and method of manufacturing the same
Publication Date: 2015.06.09 SAMSUNG ELECTRONICS CO LTD
  • US9053955B2 patent drawing
  • US9053955B2 patent drawing
  • US9053955B2 patent drawing

AI summary

A nitride semiconductor device includes a dislocation control layer on a substrate, and a nitride semiconductor layer on the dislocation control layer. The dislocation control layer includes a nanocomposite of a first nanoparticle made of a first material and at least one second nanoparticle made of a second material.