Nitride Semiconductor LED With Uneven Substrate Interface
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Solution Overview
Problem
Current semiconductor light-emitting devices, particularly LEDs made of nitride semiconductors like GaN, face challenges in improving light extraction efficiency, with existing methods showing limited effectiveness in enhancing the reflection and diffusion of light at the substrate interfaces.
Innovation Solution
The semiconductor light-emitting device incorporates a light transmissive substrate with a nitride semiconductor layer, an active layer, a dielectric layer with a lower refractive index, and a metal layer, featuring an uneven interface between the substrate and dielectric layer and a flat interface between the dielectric and metal layer, which enhances light reflection and diffusion for improved extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat interface is formed between the light transmissive substrate and the dielectric layer, then the manufacturing process is simple, but the light extraction efficiency is low
Solution Approach 1:
The patent applies the curvature principle by forming an uneven interface between the light transmissive substrate and the dielectric layer. Instead of a flat interface, the substrate surface is made curved or uneven through etching or molding processes, which causes incident light to scatter in multiple directions. This curvature transformation increases the probability of light extraction by reducing total internal reflection, thereby resolving the contradiction between manufacturing simplicity and light extraction efficiency.
2Reliability
If the refractive index of the dielectric layer is made higher, then the light guidance within the layer is improved, but the light extraction at the interface is reduced
Solution Approach 1:
The patent applies the local quality principle by creating regions with different refractive indices at the substrate-dielectric interface. The uneven interface structure creates local variations in optical properties, where some regions have higher refractive index for light guidance while other regions provide lower effective refractive index for improved light extraction. This spatial variation in optical quality allows simultaneous optimization of both light guidance and extraction efficiency.
3Loss of energy
If a complex uneven structure is formed on the substrate backside, then the light scattering and extraction efficiency are improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent applies the partial action principle by forming an uneven interface structure that provides sufficient light scattering without requiring excessive complexity. The unevenness is introduced to the extent needed to achieve optimal light extraction efficiency, rather than creating maximally complex structures. This balanced approach achieves the necessary light scattering effect while controlling manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves light extraction efficiency by scattering and reflecting light emitted from the active layer, leading to higher emission of light outside the device, as demonstrated by simulation results showing the structure with an uneven substrate interface achieving the highest light extraction efficiency among compared designs.
Implementation Method 1
an interface between the light transmissive substrate and the dielectric layer is a uneven face
Implementation Method 2
improve light extraction efficiency by scattering and reflecting light emitted from the active layer
Data Source
AI summary
According to one embodiment, a semiconductor light-emitting device having high light extraction efficiency is provided. The semiconductor light-emitting device includes a light transmissive substrate; a nitride semiconductor layer of a first conduction type formed on or above a top face side of the light transmissive substrate; an active layer made of nitride semiconductor formed on a top face of the nitride semiconductor layer of the first conduction type; a nitride semiconductor layer of a second conduction type formed on a top face of the active layer; a dielectric layer formed on a bottom face of the light transmissive substrate and having a refractive index lower than that of the light transmissive substrate; and a metal layer formed on a bottom face of the dielectric layer. And an interface between the light transmissive substrate and the dielectric layer is a uneven face, and an interface between the dielectric layer and the metal layer is a flat face.


