Noble-Metal Capacitor Electrodes for Low-Leakage Conformal Deposition
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Solution Overview
Problem
Existing methods for forming capacitors and ionic capacitors face challenges in achieving high energy storage density and conformal deposition of thin electrode layers without introducing Cl-based contaminants, which can lead to increased leakage current and corrosion.
Innovation Solution
A stacked structure comprising a bottom electrode, an intermediate layer, and a top electrode with a liner layer and a metallic layer, where the metallic layer is thicker than the liner layer, using noble metals or intermetallic materials to maintain low resistivity and avoid Cl-based precursors, deposited through ALD techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If TiN is deposited using Cl-based precursors to achieve acceptable resistivity, then electrode resistivity is reduced, but Cl-based elements are trapped in the capacitor leading to increased leakage current and corrosion
Solution Approach 1:
The patent extracts and removes the harmful Cl-based elements from the deposition process by replacing Cl-based precursors with alternative precursors that do not introduce contaminating elements, thereby eliminating the source of leakage current and corrosion while maintaining electrode functionality
Solution Approach 2:
The patent introduces an intermediary material layer between the electrode and the dielectric/ionic conductor, which serves as a barrier to prevent harmful interactions and contamination while allowing the electrode to maintain its electrical properties without direct contact with potentially damaging Cl-based environments
2Quantity of substance
If conformal deposition is performed to achieve high energy storage density, then capacitance is increased, but the electrode layers must be particularly thin which increases manufacturing difficulty
Solution Approach 1:
The patent transitions from planar two-dimensional electrode structures to three-dimensional contoured and porous structures, enabling conformal deposition across complex geometries that increase surface area and energy storage density while maintaining manufacturable thickness through vertical and radial dimensional expansion
Solution Approach 2:
The patent employs porous electrode structures with controlled pore sizes and distributions, allowing conformal deposition of thin layers throughout the porous matrix, thereby achieving high surface area and energy storage density while maintaining layer uniformity through the inherent structure of the porous material
3Object-affected harmful factors
If alternative precursors (I-based or Br-based) are used to avoid Cl-based contamination, then harmful contamination is reduced, but the resulting TiN has resistivity above 1 kOhm·cm
Solution Approach 1:
The patent employs composite electrode structures combining multiple materials and layers, including alternative precursor-derived TiN combined with other conductive materials or structured configurations, to achieve both low contamination and acceptable resistivity through synergistic material combinations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform and continuous electrode layers with low resistivity, enhancing capacitive density and preventing contamination, while maintaining low ESR and preventing parasitic chemical reactions.
Implementation Method 1
deposited through ALD techniques
Implementation Method 2
The porous structure may result from the anodization of a thin layer of aluminum deposited above the substrate
Data Source
AI summary
A method of forming an integrated component, for example a capacitor or an ionic capacitor, including: forming a stacked structure on a substrate, the stacked structure having a bottom electrode, an intermediate layer including a layer of dielectric material or a layer of ionic conductor, and a top electrode, wherein forming the top and/or the bottom electrode comprises forming a liner layer of material; and forming a metallic layer on the liner layer, the metallic layer including a noble metal, and wherein the metallic layer is thicker than the liner layer.