Non-Photosensitive Passivation Layer Laser Patterning

The patent extracts and removes the photolithography process steps (photoresist coating, exposing, developing) from the manufacturing process. Instead of using photolithography to form patterns in the protection layer and redistribution layer, the invention uses direct laser writing or other non-photolithography methods to create the necessary patterns, thereby eliminating the complexity associated with multiple masks and photoresist processing while maintaining the required manufacturing precision.

The patent replaces the optical-based photolithography system with a different approach, such as direct laser writing or mechanical patterning methods. This substitution eliminates the need for photoresist materials, masks, and associated chemical processing steps, thereby reducing device complexity and manufacturing cost while still achieving the necessary pattern formation precision for the redistribution and protection layers.

The patent merges multiple separate photolithography steps (each requiring a mask) into a single patterning operation. By using direct laser writing or integrated patterning methods, the invention can create multiple patterns and features in one process step, thereby maintaining pattern alignment precision while eliminating the sequential steps and mask changes that reduce productivity and manufacturing yield.

The patent performs preliminary patterning actions directly on the substrate or previous layers without requiring subsequent mask-based photolithography steps. By pre-forming the necessary patterns in the protection layer and redistribution layer through direct writing or other methods before final assembly, the invention eliminates the need for multiple sequential masking operations, thereby improving productivity and yield while maintaining precision.

The patent extracts and eliminates the photoresist coating, exposing, and developing steps from the manufacturing process. By using alternative patterning methods such as direct laser writing or evaporative deposition, the invention maintains feature definition precision while removing the expensive photoresist materials and associated chemical processing equipment, thereby significantly reducing manufacturing cost.

The patent replaces expensive, multi-step photolithography processes with simpler, more cost-effective methods. By using direct patterning techniques that require minimal or no consumable materials (such as photoresist), the invention achieves comparable feature definition precision while dramatically reducing the cost of materials and processing, making the manufacturing process more economical.