Non-rectangular Optoelectronic Dies for Packing Density
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Solution Overview
Problem
Conventional rectangular optoelectronic device shapes limit component packing density and sensor performance due to sparse packing and reduced active areas, constraining the placement and size of optoelectronic components within optical modules.
Innovation Solution
The integration of non-rectangular shaped optoelectronic dies, such as trapezoids, octagons, and hexagons, into optoelectronic modules, facilitated by multi-axis wafer dicing processes, allows for flexible device placement and increased active area utilization, enabling higher packing density and improved light collection or emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rectangular shaped dies are used, then the dicing process is simple and wafer utilization is maintained, but the component packing density is limited and active area is reduced
Solution Approach 1:
The patent applies asymmetry by transitioning from traditional rectangular die shapes to non-rectangular shapes (such as hexagonal, octagonal, or other polygonal forms). This shape change allows the optoelectronic components to better utilize the available wafer area and enables higher packing density in the optical module, thereby increasing the effective active area while maintaining manufacturability through adapted dicing processes
2Ease of manufacture
If rectangular shaped dies are used, then the dicing process remains simple, but the component packing density is sparse
Solution Approach 1:
By implementing non-rectangular die shapes, the patent enables more efficient spatial arrangement and packing of optoelectronic components. The geometric forms (such as hexagons or octagons) allow for tighter packing patterns that increase the number of components per wafer and improve overall component packing density in the optical module
Solution Approach 2:
The patent explores alternative geometric dimensions and arrangements by moving beyond the conventional rectangular paradigm. The non-rectangular shapes introduce new dimensional relationships and packing configurations that maximize the utilization of two-dimensional wafer space, thereby increasing component density
3Area of moving object
If non-rectangular shaped dies are integrated, then the active area is increased and packing density is improved, but the dicing process complexity increases
Solution Approach 1:
The patent accepts the increased complexity of dicing non-rectangular shapes as a necessary trade-off for achieving significantly larger active areas and improved packing density. The geometric complexity of shapes like hexagons or octagons requires more sophisticated dicing approaches, but this complexity is justified by the performance gains in terms of light collection efficiency and component utilization
Data Source
AI summary
An optoelectronic module may include one or more non-rectangular optoelectronic dies e.g., light emitting diodes and photodiodes, arranged to maximize the usage of surface area when mounted to a base circuit board. Multi-axis and non-orthogonal axis dicing processes can be used to form the dies which have non-rectangular shapes.