Non-Reflow Sensor Lens Assembly Eliminates High-Temperature Processing
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Solution Overview
Problem
Conventional sensor lens assemblies require a reflow process, limiting their structural configuration and necessitating high-temperature resistant connections, which increases material costs and reduces production efficiency.
Innovation Solution
A non-reflow sensor lens assembly configuration that includes a circuit board, optical module, sensor chip, wires, supporting adhesive layer, light-permeable sheet, top shielding layer, and opaque sealing compound, eliminating the need for a reflow process and allowing for lower temperature resistance requirements among components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a reflow process is used to fix the sensor package structure onto the circuit board, then the connection between components can resist high temperature, but the structural configuration is limited and material costs increase
Solution Approach 1:
The patent extracts and eliminates the reflow process from the manufacturing sequence, allowing the sensor chip to be directly mounted on the circuit board without requiring high-temperature resistant connections. This removes the constraint that forced complex structural configurations and limited design flexibility.
Solution Approach 2:
The patent segments the manufacturing process into independent steps: first mounting the sensor chip using low-temperature adhesive, then separately assembling the optical module. This segmentation allows each component to be optimized independently without being constrained by high-temperature processing requirements.
2Reliability
If a reflow process is used to fix the sensor package structure, then connections can withstand high temperature, but material costs and production time increase
Solution Approach 1:
The reflow process is completely extracted from the manufacturing sequence, replacing it with low-temperature adhesive mounting. This eliminates the time-consuming high-temperature heating cycle and subsequent cooling period, significantly accelerating production throughput.
Solution Approach 2:
The sensor chip is mounted on the circuit board using adhesive in advance, before optical module assembly. This preliminary action at lower temperature allows subsequent optical components to be assembled without re-exposing the entire assembly to high temperatures, maintaining production efficiency.
3Reliability
If a reflow process is used, then connections are high-temperature resistant, but the production process requires complex testing and reduces product yield
Solution Approach 1:
The reflow process and its associated high-temperature testing protocols are extracted from the manufacturing flow. The adhesive-based mounting method requires simpler, less intrusive testing procedures, reducing process complexity and increasing product yield.
4Stability of the object's composition
If conventional sensor package structure is used with reflow process, then connections are stable, but structural configuration improvements are difficult
Solution Approach 1:
The reflow process constraint is extracted, freeing the structural configuration from high-temperature resistance requirements. This enables greater adaptability in designing sensor chip layouts, optical module positions, and circuit board configurations while maintaining connection stability through adhesive bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration decreases material costs, increases product yield, and simplifies the production process by eliminating reflow-related testing, while preventing flare phenomena through effective shielding.
Implementation Method 1
a supporting adhesive layer... disposed on the sensor chip
Implementation Method 2
The inner surface of the light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip
Implementation Method 3
The top shielding layer is formed on the outer surface of the light-permeable sheet... The lateral shielding layer is formed on and occupies at least 30% of an area of the surrounding lateral surface
Data Source
AI summary
A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.