Non-Silicone Putty Thermal Interface Materials
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a challenge in developing thermal interface materials that are both highly compliant and possess high thermal conductivity, particularly for non-silicone systems used in electronic devices, as they need to efficiently manage heat and mitigate electromagnetic interference (EMI/RFI).
Innovation Solution
The development of non-silicone putties with thermally-conductive fillers, such as aluminum and hollow polymeric particles, in a non-silicone polymer base, which provide thermal conductivity of at least 3 W/mK and low hardness, allowing for effective heat transfer and EMI/RFI absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If silicone-based thermal interface materials are used to achieve high compliance and thermal conductivity, then thermal management performance is improved, but concerns arise regarding outgassing, electromagnetic interference shielding effectiveness, and compatibility with lead-free soldering processes
Solution Approach 1:
The patent employs composite materials by combining non-silicone polymer base (such as polyisobutylene or polyalphaolefin) with thermally conductive fillers (aluminum oxide, aluminum nitride, boron nitride, or zinc oxide) and hollow polymeric particles. This composite structure achieves high thermal conductivity while maintaining compliance and providing EMI shielding without the outgassing issues associated with silicones.
Solution Approach 2:
The patent changes the chemical composition parameters by eliminating silicone entirely and using alternative polymer bases. The filler content is optimized at 60-90 wt% with specific particle size distributions and aspect ratios to achieve thermal conductivity ≥3 W/m·K while maintaining Shore 00 hardness of 20-40 for high compliance.
2Temperature
If thermally conductive fillers are increased to improve thermal conductivity, then heat transfer efficiency is improved, but the material hardness increases and compliance decreases
Solution Approach 1:
The patent applies local quality by using a bimodal or trimodal distribution of filler particle sizes. Fine particles fill voids between larger particles, creating localized dense thermal pathways while the overall structure remains compliant. The hollow polymeric particles are strategically distributed to maintain compliance in specific regions while thermally conductive fillers provide thermal pathways.
Solution Approach 2:
The incorporation of hollow polymeric particles creates a porous-like structure that maintains material compliance and conformability to uneven surfaces. These hollow particles act as compliant elements that can deform under pressure, filling gaps and maintaining intimate thermal contact while the thermally conductive filler network provides heat transfer pathways through the composite matrix.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These non-silicone putties effectively conduct heat and absorb EMI/RFI, ensuring efficient thermal management and operational stability in electronic devices by maintaining high thermal conductivity and compliance, even with varying surface geometries.
Implementation Method 1
The thermal interface material may be used to fill the gap between thermal transfer surfaces, in order to increase thermal transfer efficiency
Implementation Method 2
a common solution to ameliorate the effects of EMI/RFI is through the use of shields capable of absorbing and/or reflecting and/or redirecting EMI energy
Data Source
AI summary
Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00.