Non-Contact Gripper Cavity Layout for Thin Chip Corner Stability
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Solution Overview
Problem
The deflection of semiconductor chip corners during non-contact handling leads to potential contamination due to contact with the gripper, which is exacerbated by the reduced thickness of the chips.
Innovation Solution
A non-contact type gripper with a gripping plate featuring blowing and suction holes, and cavities to maintain gas pressure, preventing deflection by applying a strong suction force without contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the thickness of the semiconductor chip is decreased, then the productivity and integration density are improved, but the corner portion of the chip becomes prone to deflection and contact with the gripper
Solution Approach 1:
The patent applies different pressure control strategies to different regions of the chip. Corner regions receive enhanced positive pressure from cavities extending from corner blowing holes, while central regions receive standard pressure. This localized quality adjustment prevents corner deflection without affecting overall chip handling, allowing thin chips to be gripped non-contactly without contamination risk.
2Manufacturing precision
If a non-contact type gripper is used to avoid contamination, then the purity of the semiconductor chip is improved, but the corner portion may still contact the gripper due to deflection
Solution Approach 1:
The patent uses positive pressure from gas injection through blowing holes and cavities to counterbalance the negative suction force applied by suction holes. This creates a pressure equilibrium that prevents chip corners from deflecting downward toward the gripper surface, maintaining non-contact gripping while preventing contamination.
Solution Approach 2:
The patent dynamically adjusts pressure parameters by controlling gas flow rates through blowing holes and vacuum levels at suction holes. By optimizing these parameters, the system maintains sufficient holding force for non-contact gripping while preventing excessive suction that would cause corner deflection and contact contamination.
3Reliability
If strong suction force is applied to grip the chip without contact, then the gripping reliability is improved, but the pressure drop causes deflection of the corner portion
Solution Approach 1:
The patent divides the gripping surface into multiple independent pressure zones with separate blowing and suction holes. Each zone can be controlled independently, allowing strong suction for reliable gripping while compensating for pressure drops in specific regions through localized gas injection, preventing corner deflection without compromising overall gripping reliability.
Solution Approach 2:
The patent introduces gas injection through blowing holes as an intermediary mechanism between the suction force and the chip. This intermediary positive pressure compensates for the pressure drop caused by strong suction, maintaining chip stability at corners while allowing sufficient suction force for reliable non-contact gripping.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The gripper effectively grips semiconductor chips without deflection, maintaining pressure and preventing contamination by suppressing pressure drops through cavities, ensuring non-contact handling.
Implementation Method 1
a plurality of blowing holes formed at the gripping plate to inject a gas to an object
Implementation Method 2
a plurality of suction holes formed at the gripping plate to suck the gas
Implementation Method 3
a first cavity extended from a first blowing hole of the plurality of blowing holes to suppress a pressure drop of the gas
Data Source
AI summary
A non-contact type gripper may include a gripping plate, a plurality of blowing holes, a plurality of suction holes and a cavity. The blowing holes may be formed at the gripping plate to inject a gas to an object. The suction holes may be formed at the gripping plate to suck the gas. The cavity may be extended from at least one of the blowing holes to suppress a pressure drop of the gas. The gas flowing through the cavities extended from the corner suction hole and the blowing holes between the adjacent suction holes may receive a low flow resistance. Thus, a pressure drop of the gas injected from the blowing holes may be suppressed by the cavities to maintain a pressure of the gas, thereby preventing a deflection of the corner portion of the object such as the semiconductor chip by a strong suction force. As a result, the non-contact type gripper may grip the object in the non-contact manner to prevent a contamination of the object.