Non-Contact Module Interfaces for Semiconductor Tool Wiring Reduction

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Solution Overview

Problem

The complexity and size of semiconductor manufacturing apparatuses lead to numerous wiring connection operations, which hinder productivity and increase the likelihood of connection errors, particularly due to the cumbersome nature of high and low-position wiring operations.

Innovation Solution

The implementation of non-contact communication devices that allow for data and power transmission between components without physical wires, reducing the operational burden and eliminating the need for precise alignment during assembly by using first and second communication devices with non-contact surfaces that oppose each other without touching, enabling wireless communication between modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional wired connections are used for data and power transmission between housing components, then reliable communication is achieved, but the number of wiring operations increases significantly and assembly complexity increases

Engineering Contradiction:

Improvecommunication reliabilityVSAvoidwiring complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces mechanical wired connections with non-contact communication devices that use electromagnetic fields for data and power transmission. The first communication device in the first housing and the second communication device in the second housing enable wireless communication, eliminating the need for physical wire connections between housing components.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts the communication function from the mechanical wiring system by introducing dedicated non-contact communication devices. These devices are integrated into the housing structure, separating the communication function from traditional wired connections and enabling wireless data and power transmission.

Inventive Principle:

Principle #2Taking out (Extraction)

2Quantity of substance

If numerous wiring connections are made during assembly, then complete connectivity is achieved, but productivity decreases and assembly time increases

Engineering Contradiction:

Improveconnection completenessVSAvoidassembly productivity

Core Design Contradiction:

Quantity of substanceVSProductivity

Solution Approach 1:

The patent replaces numerous mechanical wiring operations with a single non-contact communication device integration. The first and second communication devices establish multiple data and power connections simultaneously through electromagnetic fields, eliminating the need for individual wire connections and significantly reducing assembly steps.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent merges multiple separate wiring functions (data transmission, power supply, control signals) into a single non-contact communication interface. The communication devices integrate these functions, allowing simultaneous transmission of multiple signals without requiring separate physical connections for each function.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If wired connections are used for high and low position components, then stable power and data transmission is achieved, but operability deteriorates due to difficult wiring operations

Engineering Contradiction:

Improvetransmission stabilityVSAvoidwiring operability

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent replaces difficult mechanical wiring operations with non-contact communication devices that can be installed without complex wire routing. The communication devices transmit signals through electromagnetic fields, eliminating the need for workers to perform challenging high-position and low-position wiring tasks while maintaining stable transmission.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Quantity of substance

If traditional wiring methods are used, then comprehensive connectivity is achieved, but the likelihood of connection errors increases

Engineering Contradiction:

Improveconnection coverageVSAvoidconnection accuracy

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent replaces manual wiring operations with non-contact communication devices that eliminate human error in connection making. The automated electromagnetic field-based communication ensures accurate and consistent connections without the variability and error potential associated with manual wire connection and termination.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20240014064A1Semiconductor manufacturing apparatus including non-contact communication devices

Publication Date: 2024.01.11 ASM IP HLDG BV

AI summary

Examples of a semiconductor manufacturing apparatus includes a first housing, at least one first communication device fixed to the first housing and having a first non-contact communication surface exposed from the first housing, a second housing fixed to the first housing, and at least one second communication device fixed to the second housing and having a second non-contact communication surface exposed from the second housing. The first non-contact communication surface and the second non-contact communication surface oppose each other without contacting each other.