Non-Planar Substrate Chuck for Precise High-Throughput Die Transfer
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Solution Overview
Problem
Advanced packaging technologies face challenges in achieving high throughput while maintaining precise die placement, particularly in hybrid bonding where small misalignment tolerances are difficult to meet, and single-chip transfer techniques offer high precision but low throughput.
Innovation Solution
An apparatus with a non-planar substrate chuck and pick-up heads equipped with non-contact die chucks, including Bernoulli chucks and vacuum systems, that deform the source substrate to reduce contact area and facilitate precise die placement and transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single-chip transfer technique is used, then placement precision is improved, but throughput deteriorates
Solution Approach 1:
The substrate is divided into multiple regions with different degrees of deformation, allowing simultaneous processing of multiple dies at different stages of release. This enables parallel transfer operations while maintaining precision through localized control.
Solution Approach 2:
The substrate deformation is dynamically controlled through adjustable retention forces that can be varied across different regions and time periods. This allows the system to adapt between precision-oriented and throughput-oriented modes by adjusting the deformation characteristics.
2Productivity
If a multi-chip transfer technique is used, then throughput is improved, but placement precision deteriorates
Solution Approach 1:
Different regions of the substrate are given different local properties through selective deformation. Areas where precision is critical maintain closer contact with the substrate, while other areas are more strongly deformed for faster release, enabling multi-chip transfer with maintained precision.
Solution Approach 2:
The substrate is pre-deformed into a non-planar configuration before die transfer begins. This preliminary action creates built-in release zones that facilitate multi-chip transfer while maintaining alignment precision through the pre-established deformation pattern.
3Force
If the source substrate is deformed to reduce contact area, then die pickup force is reduced, but substrate control complexity increases
Solution Approach 1:
The substrate is deformed into a non-planar configuration with curved surfaces that naturally reduce contact area with the die. This geometric approach simplifies the force requirements while the deformation pattern is controlled through a systematic retention module design.
Solution Approach 2:
A retention module uses pneumatic or hydraulic forces to control substrate deformation. This provides precise control over the non-planar configuration through pressure adjustments, managing the complexity through fluid-based actuation rather than mechanical linkages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-throughput die placement with precise alignment, reducing the force required for die pickup and transfer, and minimizing contact with adhesive layers, thus improving the efficiency and accuracy of die placement in advanced packaging technologies.
Implementation Method 1
The first non-contact die chuck includes a Bernoulli chuck
Implementation Method 2
vacuum systems
Data Source
AI summary
An apparatus can include a pick-up head including a non-contact die chuck for holding a die; a substrate chuck having a non-planar chucking surface configured to hold a source substrate; and a substrate retention module that is configured to provide a force in a direction from the source substrate toward the substrate chuck, wherein the force is sufficient to deform the source substrate. A method of using the apparatus can include placing a source substrate along a non-planar chucking surface of a source chuck, wherein a die is associated with the source substrate; and picking up the die from the source substrate using a pick-up head having a non-contact die chuck, wherein before picking up the die, the source substrate contacts spaced-apart portions of the die, and the source substrate does not contact another portion of die between the spaced-apart portions of the source substrate.