Novel Salt Acid Generator for Photoresist Resolution and Etch Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current photoresist compositions using existing acid generators face limitations in achieving optimal resolution and dry-etching resistance due to the acidity of the generated acids, which can affect the precision and durability of the photoresist patterns.
Innovation Solution
A novel salt represented by formula (I) is introduced, which acts as an acid generator in a photoresist composition, along with a resin having acid-labile groups, to produce a photoresist pattern through a specific process involving application, exposure, baking, and development, utilizing a salt that generates a weaker acid to improve pattern resolution and resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing acid generators are used in photoresist composition, then the photoresist composition can be formed, but the resolution and dry-etching resistance of the photoresist pattern are insufficient
Solution Approach 1:
The patent changes the chemical parameters of the acid generator by introducing a novel salt with specific molecular structure (formula I) containing fluorine atoms and perfluoroalkyl groups. This structural modification alters the acid strength parameter, generating a weaker acid that provides optimal balance between resolution and dry-etching resistance, resolving the contradiction between these two performance parameters.
Solution Approach 2:
The patent creates a composite photoresist composition by combining the novel salt (acid generator) with specific resin components. This composite approach allows synergistic effects where the salt provides controlled acid generation for high resolution while the resin matrix maintains structural integrity for dry-etching resistance, simultaneously improving both parameters.
2Manufacturing precision
If acid generators with strong acidity are used, then the photoresist composition can be formed, but the precision of the photoresist pattern deteriorates
Solution Approach 1:
The patent modifies the acid strength parameter by designing a salt with fluorine-containing groups and perfluoroalkyl substituents that stabilize the conjugate base, thereby reducing the acidity of the generated acid. This parameter change prevents excessive acid strength from degrading pattern precision while maintaining sufficient reactivity for photoresist formation.
Solution Approach 2:
The patent converts the potentially harmful strong acidity into a beneficial weaker acid generation. The fluorine atoms and perfluoroalkyl groups, which electron-withdraw, stabilize the anion and reduce acid strength, transforming what would be a harmful overly-strong acid into a beneficial weaker acid that preserves pattern precision while still enabling photoresist composition formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the novel salt and resin combination enhances the resolution and dry-etching resistance of the photoresist patterns, addressing the limitations of existing acid generators by controlling acid strength and improving pattern quality.
Implementation Method 1
a salt which generates a weaker acid than an acid generated from conventional acid generators
Implementation Method 2
a step of exposing the composition film to radiation
Data Source
AI summary
A salt represented by the formula (I):whereinR1 represents a C1 to C12 alkyl group in which a methylene group can be replaced by an oxygen atom or a carbonyl group;Q1 and Q2 each independently represent a fluorine atom or a C1 to C6 perfluoroalkyl group;A1 represents a lactone ring-containing group which has 4 to 24 carbon atoms;R2 represents an acid-labile group; and“m” represents an integer of 0 to 3.