Novolac Curing Agent Alkoxysilyl Group Low CTE
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Solution Overview
Problem
Current epoxy resin composites face limitations due to high Coefficient of Thermal Expansion (CTE), which leads to issues like crack formation, warpage, and peeling in electronic components, hindering the development of next-generation semiconductor substrates and printed circuit boards with high integration, miniaturization, and flexibility requirements.
Innovation Solution
A novel novolac curing agent with an alkoxysilyl group is developed, which forms a composite with low CTE and high glass transition temperature, along with excellent flame retardancy, achieved through specific chemical bonding with fillers and epoxy resins, improving thermal resistance and processability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large amount of inorganic particles is added to reduce CTE, then thermal expansion properties are improved, but processability deteriorates due to decreased fluidity and void formation
Solution Approach 1:
The invention changes the chemical composition parameters of the curing agent by introducing an alkoxysilyl group with a specific structural formula. This chemical modification enables the curing agent to form strong chemical bonds with inorganic fillers, allowing effective CTE reduction at lower filler concentrations, thus improving processability while maintaining thermal expansion properties
Solution Approach 2:
The invention creates a composite curing system where the novolac curing agent with alkoxysilyl group forms a hybrid network structure by chemically bonding with inorganic fillers. This composite approach at the molecular level enhances the interaction between organic resin and inorganic particles, achieving synergistic effects that reduce CTE without compromising processability
2Stability of the object's composition
If glass fiber is added to reduce CTE, then thermal expansion properties are improved, but the CTE remains relatively high compared to silicon chip
Solution Approach 1:
The invention modifies the curing agent's chemical structure by incorporating alkoxysilyl groups that can form silane crosslinks and chemical bonds with inorganic fillers. This chemical parameter change creates a more rigid and thermally stable network structure that better matches the CTE of silicon chips, achieving superior CTE control compared to conventional glass fiber composites
3Stability of the object's composition
If inorganic particles are added to improve thermal expansion properties, then CTE is reduced, but adhesive properties deteriorate due to poor interfacial bonding
Solution Approach 1:
The invention changes the chemical reactivity parameters of the curing agent by introducing alkoxysilyl groups that undergo hydrolysis and condensation reactions. These chemical transformations enable the curing agent to form strong covalent bonds with inorganic filler surfaces, creating robust interfacial adhesion that maintains both structural integrity and improved CTE properties
Solution Approach 2:
The alkoxysilyl group acts as a chemical intermediary or coupling agent between the organic novolac resin and inorganic fillers. It forms a bridge structure that chemically bonds to both the resin matrix and filler particles, enhancing interfacial adhesion and ensuring effective stress transfer while maintaining improved thermal expansion characteristics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The novel novolac curing agent significantly reduces CTE, increases glass transition temperature, and enhances flame retardancy, thereby improving dimensional stability and adhesive properties, making it suitable for advanced electronic components.
Implementation Method 1
achieved through specific chemical bonding with fillers and epoxy resins
Implementation Method 2
The compound of Formula I reacts with water to undergo hydrolysis of the alkoxysilyl group
Data Source
AI summary
A new novolac curing agent with an alkoxysilyl group exhibiting excellent heat resistance such as a low CTE and an high Tg when a composite is formed, a preparing method of the same, a composition including the same, a cured article, and an use thereof, are provided. The new novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a preparing method of the new novolac curing agent by alkenylation and alkoxysilylation of the novolac curing agent, a preparing method of the new novolac curing agent by alkoxysilylation of a novolac curing agent, a composition including a novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a cured article and a use thereof, are provided. A composite including a novel novolac curing agent having an alkoxysilyl group exhibits a low CTE and a high glass transition temperature.