Nozzle Arm Purging During Substrate Transfer in Photoresist Coating
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Solution Overview
Problem
Existing substrate treating apparatuses face inefficiencies in performing purge operations during photolithographic processes for semiconductor device manufacturing, particularly in ensuring the cleanliness and proper functioning of nozzles while treating substrates.
Innovation Solution
A substrate treating apparatus with a nozzle arm and purge port system, where a controller manages the movement of nozzles between substrate support members to perform purge operations, clean the nozzles, and prevent substrate handling during nozzle maintenance, ensuring efficient treatment and maintenance of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If purge operations are performed separately from substrate treatment, then nozzle cleanliness is maintained, but productivity decreases due to idle time
Solution Approach 1:
The system enables continuous operation by performing purge operations during the substrate transfer time. The nozzle arm moves to the purge port position while carrying out substrate treatment on one substrate, then performs purge on the nozzle during the transfer to the next substrate, eliminating idle purge time and maintaining continuous productive action.
Solution Approach 2:
The system performs preliminary positioning of the nozzle arm to the purge port location during the substrate treatment process. By pre-positioning the nozzle arm and coordinating the purge timing with substrate transfer, the system prepares for the next treatment cycle without interrupting productivity.
2Productivity
If purge operations are performed during substrate treatment, then productivity is improved, but substrate handling safety may be compromised
Solution Approach 1:
The nozzle arm operations are segmented into distinct functional zones: substrate treatment position, transfer position, and purge port position. The controller coordinates these segmented movements with substrate processing steps, ensuring that purge operations occur only when the nozzle arm is in the appropriate position and substrate handling is either complete or not yet initiated.
Solution Approach 2:
The controller monitors the positions of the substrate support members and coordinates nozzle arm movements based on real-time feedback. The system adjusts the timing of purge operations according to the actual substrate handling status, ensuring safety conditions are met before initiating purge sequences.
3Area of stationary object
If multiple nozzles are used for substrate treatment, then treatment coverage is improved, but purge operation complexity increases
Solution Approach 1:
The single purge port serves as a universal interface for all nozzles on the nozzle arm. Regardless of which nozzle requires purging, the arm moves to the same purge port location, simplifying the control logic while maintaining the ability to service multiple nozzles used for comprehensive substrate coverage.
Data Source
AI summary
Disclosed are a substrate treating apparatus and a substrate treating method. According to an embodiment of the inventive concept, the purge operation of the purge nozzle is performed while the nozzle arm is moved from the first substrate support member to the second substrate support member, it hardly influences the operation of treating the substrate while the nozzle arm is moved from the first substrate support member to the second substrate support member. According to an embodiment of the inventive concept, the substrate treating apparatus may perform an operation of purging the photosensitive liquid nozzle while the treatment liquid supply unit performs a process of supplying the photosensitive liquid to the substrate. Accordingly, because the operation of purging the photosensitive liquid nozzle is performed at the same time when the substrate treating apparatus performs a process, productivity may be improved.