Offset LED Module Leads for Compact Chip Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED modules have limited flexibility in mounting LED chips and wire bonding positions, making it difficult to produce compact designs due to fixed lead arrangements and spacing.
Innovation Solution
The LED module design features offset leads and bulging portions on a metal plate, allowing for closer placement of LED chips and optimized wire bonding, enabling a smaller form factor and improved manufacturing process through stretching and punching techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional leads with fixed spacing are used, then the manufacturing process is simple, but the LED module size cannot be reduced and mounting flexibility is limited
Solution Approach 1:
The patent applies asymmetry by making the spacing between adjacent primary leads different from the spacing between adjacent secondary leads. Specifically, the distance between first-pole leads differs from the distance between second-pole leads, creating an asymmetric lead arrangement that enables compact LED chip mounting while maintaining manufacturing feasibility through asymmetric bulging portions in the metal plate.
Solution Approach 2:
The patent utilizes the metal plate thickness dimension by forming bulging portions that protrude from both surfaces of the plate. This three-dimensional approach allows leads to be positioned at different heights and locations, enabling closer spacing and more flexible arrangement without interfering with each other, thus reducing the overall module size.
2Adaptability or versatility
If equal spacing between primary and secondary leads is used, then presswork manufacturing is simple, but wire bonding positions are limited
Solution Approach 1:
The patent applies local quality by creating bulging portions at specific locations on the metal plate that correspond to where leads need to be positioned. These localized bulges enable precise lead placement for wire bonding without requiring complex overall reconfiguration of the entire lead arrangement, thus maintaining manufacturing simplicity while improving bonding flexibility.
Solution Approach 2:
The patent performs preliminary action by pre-forming the asymmetric bulging portions in the metal plate before the actual lead formation and wire bonding processes. This pre-positioning of material allows subsequent leads to be accurately placed at optimal locations for wire bonding, eliminating the need for complex adjustments during later manufacturing stages.
3Ease of manufacture
If leads are spaced evenly, then stamping process is straightforward, but compact design is difficult to achieve
Solution Approach 1:
The patent applies segmentation by dividing the metal plate into multiple regions with different bulging portions at specific locations. Each bulging portion corresponds to a specific lead position, allowing the stamping process to create complex asymmetric lead arrangements through a series of localized forming operations rather than requiring a completely new manufacturing approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a more compact LED module design with improved stability and reduced interference between wires and leads, facilitating easier assembly and preventing lead detachment from the housing.
Implementation Method 1
stretching the first-pole first bulging portion in the first direction toward the second-pole side; stretching the second-pole second bulging portion and the second-pole third bulving portion in the first direction toward the first-pole side
Data Source
AI summary
A compact LED module and a method of manufacturing such an LED module are provided. The LED module includes a first-pole first lead, a first-pole second lead, a first-pole third lead, a second-pole first lead, a second-pole second lead, a second-pole third lead, a first LED chip, a second LED chip, a third LED chip, and a housing. A distal end of the first-pole first lead is offset toward a second-pole side in a first direction with respect to both a distal end of the second-pole second lead and a distal end of the second-pole third lead.