OLED Thin Film Encapsulation Edge Protection via ALD
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Solution Overview
Problem
OLED displays using thin film encapsulation face challenges in preventing moisture and oxygen permeation along the side surface direction, which can degrade the organic emission layer and require complex manufacturing processes.
Innovation Solution
A multi-layered thin film encapsulation structure is implemented, including a first inorganic layer formed by atomic layer deposition (ALD) adjacent to the organic light emitting diode, an intermediate layer covering a smaller area, and a second inorganic layer contacting the first layer at the edge, with optional additional layers, to effectively suppress moisture and oxygen permeation while minimizing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thin film encapsulation is used to reduce thickness and enable flexible display, then device thickness is reduced and flexibility is improved, but moisture and oxygen can easily permeate along the interface of the thin film encapsulation at the edge of the substrate
Solution Approach 1:
The patent extends the encapsulation protection from the top surface to the side surface by forming additional inorganic layers that cover the edge region of the substrate. This dimensional extension prevents moisture and oxygen permeation along the interface at the edge, resolving the contradiction between thin film encapsulation benefits and edge protection deficiencies
Solution Approach 2:
The patent creates a composite encapsulation structure combining multiple inorganic layers with different coverage areas. The first inorganic layer covers the entire OLED area, while the second inorganic layer specifically covers the edge region, forming a composite barrier system that addresses both thickness reduction and edge protection requirements
2Volume of moving object
If thin film encapsulation is used instead of encapsulation substrate, then OLED display thickness is significantly reduced, but complex manufacturing processes are required to achieve effective edge protection
Solution Approach 1:
The patent merges the encapsulation function with the thin film structure by integrating edge protection layers directly into the thin film encapsulation process. This combination achieves both thickness reduction and effective edge protection through a unified manufacturing approach, reducing overall process complexity
Solution Approach 2:
The patent applies different inorganic layers with specific properties to different regions: the first inorganic layer provides general protection over the OLED area, while the second inorganic layer provides enhanced protection at the edge region. This localized quality approach achieves effective edge protection without requiring complex overall manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the suppression of moisture and oxygen permeation along the side surface direction, simplifies the manufacturing process, and reduces damage to the organic light emitting diode during encapsulation, resulting in a more reliable and efficient OLED display.
Implementation Method 1
The first inorganic layer may be formed through an atomic layer deposition (ALD) method
Data Source
AI summary
An organic light emitting diode (OLED) display includes: a substrate; an organic light emitting diode formed on the substrate; a first inorganic layer formed on the substrate and covering the organic light emitting diode; an intermediate layer formed on the first inorganic layer and covering an area relatively smaller than the first inorganic layer; and a second inorganic layer formed on the first inorganic layer and the intermediate layer, and contacting the first inorganic layer at an edge thereof while covering a relatively larger area than the intermediate layer. A third inorganic layer may be formed on the second inorganic layer so as to contact the second inorganic layer at an edge thereof. At least one of the first, second and third inorganic layers is formed by an atomic layer deposition (ALD) method.