OLED Array Substrate Microcavity Tuning for Color Uniformity
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Solution Overview
Problem
The light-emitting performance of OLED display panels is affected by the non-uniform spreading effect of sideband vibration and transition in the light-emitting functional layer, particularly impacting blue and red light emission.
Innovation Solution
An array substrate with a driving circuit board, insulating layer, and anode structure, featuring a reflective layer, intermediate dielectric layer, and transparent conductive layer, where the thickness of the intermediate dielectric layer is sequentially increased across different pixel regions to adjust microcavity lengths, thereby narrowing the Full Width Half Maximum (FWHM) of emission spectra and improving light-emitting performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the thickness of the intermediate dielectric layer is increased in specific pixel regions, then the microcavity length is optimized and light-emitting performance is improved, but the manufacturing complexity increases due to the need for selective thickness control
Solution Approach 1:
The patent applies local quality by making the intermediate dielectric layer have different thicknesses in different pixel regions. Specifically, the intermediate dielectric layer has a first thickness in first pixel regions and a second thickness in second pixel regions, where the first thickness is greater than the second thickness. This local variation optimizes the microcavity length for different light-emitting materials (e.g., blue vs. red organic materials) to improve light-emitting performance and color uniformity across the display panel.
Solution Approach 2:
The patent changes the physical parameter of the intermediate dielectric layer thickness to optimize performance. By adjusting the thickness parameter of the intermediate dielectric layer in different pixel regions, the microcavity length is controlled to match the specific requirements of different light-emitting materials, thereby improving the FWHM characteristics and overall light-emitting performance.
2Reliability
If via holes are formed through the insulating layer to connect electrode layers, then electrical connection is achieved, but the fabrication complexity increases due to the need for precise via hole positioning and depth control
Solution Approach 1:
The patent applies universality by making the insulating layer serve multiple functions: it acts as an insulating barrier between the first and second electrode layers, and simultaneously serves as the medium through which via holes are formed to establish electrical connections. The via holes penetrate the insulating layer to connect the first electrode layer with the anode structure, achieving both insulation and electrical connection functions through a single layer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the uniformity of light emission across different colors, improving the display quality by optimizing the microcavity lengths for blue, red, and green light-emitting devices and simplifies the fabrication process by maintaining consistent via hole depths across pixel regions.
Implementation Method 1
the anode structure includes a reflective layer, an intermediate dielectric layer, and a transparent conductive layer
Data Source
AI summary
The present disclosure provides an array substrate including a driving circuit board, and a first electrode layer, an insulating layer, and an anode structure sequentially stacked thereon. The anode structure includes a reflective layer, an intermediate dielectric layer, and a transparent conductive layer sequentially provided in a direction away from the driving circuit board. The array substrate has first, second, and third pixel regions. The anode structure includes first, second, and third anode structures. The first electrode layer includes first, second and third sub-portions. The first, second and third anode structures are coupled with the first, second and third sub-portions through first, second and third via holes in the insulating layer, respectively. A surface of the insulating layer in contact with the first, second and third anode structures is flush; and a thickness of the intermediate dielectric layer in the second, first and third anode structures increases sequentially.