OLED Array Substrate Packaging with Minimal Edge Frame
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Solution Overview
Problem
The existing packaging process for organic light-emitting diode (OLED) array substrates is inefficient due to the need for separate adhesive coating and laser curing of frame adhesives, resulting in wasted time and materials, and underutilization of substrates, with a large edge frame and long processing times.
Innovation Solution
A method involving coating a frame adhesive between adjacent OLED display panels without cutting headroom, followed by laser curing and ablating the adhesive at specific locations to facilitate cutting into single display panels, eliminating the need for separate coating and curing of each panel and reducing the edge frame size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate adhesive coating and laser curing processes are performed for each display panel, then the packaging process can be completed with traditional methods, but the production time is extended and production efficiency is reduced
Solution Approach 1:
The patent merges multiple display panels into an array substrate structure, allowing the frame adhesive to be coated and cured simultaneously across multiple panels. This combining approach eliminates the need for separate coating and curing operations for each individual panel, thereby reducing total process time and improving production efficiency.
Solution Approach 2:
The patent performs preliminary actions by pre-coating the frame adhesive across the entire array substrate before final curing. This allows the adhesive to be applied to multiple panels in advance, and the subsequent curing process can be optimized to affect multiple panels simultaneously, rather than processing each panel sequentially.
2Ease of manufacture
If cutting headroom is provided between adjacent display panels, then the panels can be separated after packaging, but the edge frame size increases and substrate utilization decreases
Solution Approach 1:
The patent applies local quality by providing cutting headroom only at specific locations where panels need to be separated, rather than maintaining uniform spacing across the entire array. This allows the frame adhesive to be minimized in areas where cutting is not required, thereby reducing overall edge frame size and improving substrate utilization while still enabling necessary panel separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach shortens the packaging process, improves substrate utilization, and enhances production efficiency by eliminating the need for separate adhesive application and curing, while reducing the edge frame size and material waste.
Implementation Method 1
laser curing the coated frame adhesive separately
Implementation Method 2
ablating the adhesive at specific locations to facilitate cutting
Data Source
AI summary
A single display panel and an electronic device are provided. The single display panel comprises an upper substrate; a lower substrate including a display area and a stepped area; and a frame adhesive disposed between the upper substrate and the to a substrate, and surrounding the display area, wherein there is no blank area around the display panel. The single display panel is obtained from an array substrate comprising OLED display panels to be separated from each other through a cutting, wherein the display panel includes a display area, at least two adjacent display panels are connected through the frame adhesive disposed at an edge frame surrounding the display area but not covering the display area, and there is no cutting headroom between at least one side of the at least two adjacent display panels.