OLED Array Substrate Packaging-Reserved Slot for Laser Cutting Protection
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Solution Overview
Problem
Current OLED display manufacturing processes damage the organic light-emitting layer and packaging structure during laser cutting, especially in abnormal or curved cuts, leading to thermal expansion and moisture infiltration, which compromises the display's performance and longevity.
Innovation Solution
The introduction of an array substrate with a base substrate and film layers featuring an installation slot and a packaging-reserved slot, where the packaging material with a preset thickness covers the organic light-emitting unit adjacent to the edge of the installation slot, preventing heat damage and environmental exposure during laser cutting and slotting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If laser cutting is used to create installation slots in OLED displays, then the display can accommodate hardware structures and achieve narrow frame designs, but the organic light-emitting layer and packaging structure are damaged by thermal expansion and moisture infiltration
Solution Approach 1:
The packaging-reserved slot is formed beforehand in the packaging structure before laser cutting of the installation slot. This preliminary action creates a protective cavity that prevents moisture infiltration and thermal damage to the organic light-emitting layer during the subsequent laser cutting process, thereby maintaining display reliability while enabling hardware structure accommodation
Solution Approach 2:
The packaging-reserved slot acts as an intermediary protective structure between the installation slot and the organic light-emitting layer. It provides physical separation and protection, preventing direct exposure to cutting heat and moisture, thus resolving the contradiction between adaptability and reliability
2Shape
If installation slots are provided for hardware structures, then the display achieves narrow frame and full screen designs, but the organic light-emitting unit is exposed to environmental factors and cutting heat
Solution Approach 1:
The packaging-reserved slot is formed in advance in the packaging structure at the location where the installation slot will be created. This preliminary preparation ensures that when the installation slot is cut for narrow frame design, the packaging-reserved slot already exists to protect the organic light-emitting unit from environmental factors and cutting heat
Solution Approach 2:
The packaging material is selectively removed to form the packaging-reserved slot, extracting only the necessary protective cavity while leaving the rest of the packaging structure intact to continue protecting the organic light-emitting unit from environmental exposure
Data Source
AI summary
According to an embodiment, the present invention provides an array substrate that includes a base substrate and a number of film layers provided on the base substrate. The base substrate is provided with an installation slot that provides an installation space for a hardware structure. A packaging-reserved slot is defined in a number of film layers and extending through at least a part of the film layers. The installation slot extends through the base substrate in a thickness direction of the array substrate, and the packaging-reserved slot surrounds the installation slot.