OLED Display Back Cover Recess Layout for Heat Dissipation
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Solution Overview
Problem
Conventional image display devices with organic electroluminescent (OLED) panels face challenges in reducing thickness while maintaining heat dissipation, leading to potential temperature degradation and reduced image quality due to the placement of drive circuit substrates and flexible printed circuits (FPCs).
Innovation Solution
The image display device incorporates a back cover with recesses and protrusions to accommodate FPCs, allowing efficient heat dissipation through a thermally conductive adhesive sheet and a support frame, while the drive IC is thermally connected to a metal bottom frame for effective heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If drive circuit substrates and FPCs are placed on the back surface of the display panel, then the thickness of the image display device is reduced, but heat dissipation capability deteriorates leading to temperature degradation
Solution Approach 1:
The patent transitions from planar placement of drive circuits on the back surface to three-dimensional utilization of recesses within the back cover structure. By creating recess portions in the back cover, the design accommodates FPCs and drive circuits in a vertical dimension while maintaining efficient heat dissipation pathways to the outer surface of the back cover.
Solution Approach 2:
The back cover serves as an intermediary thermal management component, with its recess portions acting as intermediate chambers that house heat-generating components while maintaining thermal connection to the heat-dissipating outer surface of the back cover.
2Length of moving object
If drive circuit substrates are placed on the back surface, then device thickness is reduced, but image quality deteriorates due to temperature degradation
Solution Approach 1:
The patent utilizes the vertical dimension by creating recesses within the back cover thickness, allowing drive circuits to be positioned away from the display panel while maintaining compact overall thickness and ensuring proper thermal management for image quality.
Solution Approach 2:
The patent converts the heat-generating property of drive circuits, which normally causes temperature degradation and image quality deterioration, into a beneficial thermal management opportunity by positioning these components within recesses that facilitate efficient heat dissipation to the back cover surface.
3Temperature
If FPCs are accommodated in recesses of the back cover, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The back cover is designed to serve multiple functions simultaneously: it provides structural support, enables heat dissipation through its recess portions that accommodate FPCs, and maintains aesthetic appearance. This multi-functionality reduces the need for separate dedicated heat dissipation components.
Solution Approach 2:
The patent merges the housing function and heat dissipation function into a single integrated back cover structure, where the recess portions serve both as mounting locations for FPCs and as thermal pathways, eliminating the need for separate heat sinks or ventilation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances image quality by reducing temperature degradation and minimizing thickness, achieving improved heat dissipation without increasing the device's thickness, thus addressing the issues of reduced luminance and contrast.
Implementation Method 1
a back cover 40 disposed along a back surface of the display panel 20
Implementation Method 2
the drive IC is thermally connected to a metal bottom frame for effective heat management
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
An image display device (10) includes a display panel (20) which displays an image, a back cover (40) disposed along the back surface of the display panel (20), a circuit substrate (60) which is disposed on the back surface of the back cover (40) and which is for driving the display of the image on the display panel (20), and a FPC (61) which connects the circuit substrate (60) and the display panel (20). The back cover (40) has a recess (41) recessed inward from the edge of the back cover (40) in a plan view. The FPC (61) is disposed so as to pass through the recess (41).