OLED Display Buffer Unit for Stress Relief and Yield Improvement
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Solution Overview
Problem
OLED display panels face reduced yield rates due to stress-induced deformation and cracking of glass substrates and frit units during the sintering and cutting processes, primarily caused by uneven thermal distribution and residual stress.
Innovation Solution
Incorporating a buffer unit between the substrates and frit units to absorb stress and facilitate even thermal distribution, and strategically cutting the substrates to minimize border regions while maintaining the buffer unit's protective function.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If frit units are used to seal the panel for moisture barrier property, then moisture barrier performance is improved, but residual stress causes frit units to crack or break during laser sintering
Solution Approach 1:
The sealing structure is divided into two functional parts: frit units for moisture barrier and a buffer unit for stress absorption. This segmentation allows each component to specialize in its function without compromising the other.
Solution Approach 2:
The buffer unit acts as an intermediary element between the frit units and the substrate. It absorbs residual stress generated during laser sintering, preventing stress transmission to the frit units and avoiding their cracking or breaking.
2Reliability
If laser sintering is used to process frit units, then sealing performance is improved, but uneven thermal distribution causes residual stress and substrate deformation
Solution Approach 1:
The buffer unit is designed with specific material properties (elasticity, thermal conductivity) that differ from the substrate and frit units. These parameter changes enable it to absorb thermal stress and distribute heat more evenly during laser sintering, reducing substrate deformation.
3Manufacturing precision
If substrates are fixed tight during assembly, then alignment precision is improved, but residual stress generates extremely high stress during cutting
Solution Approach 1:
The buffer unit is pre-installed between the substrates and frit units before laser sintering and cutting processes. It provides beforehand cushioning by absorbing residual stress that will be generated during these processes, preventing extremely high stress during cutting operations.
4Productivity
If buffer unit is added to absorb stress, then yield rate is improved, but device complexity increases
Solution Approach 1:
The buffer unit is made from materials with similar properties to the existing sealing components, allowing it to be integrated into the current manufacturing process without requiring entirely new processing techniques or equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer unit effectively reduces substrate deformation and frit unit cracking, improving yield rates and enabling the production of OLED display panels with narrow border regions.
Implementation Method 1
the buffer unit has a first end with a first cutting edge connecting to the second edge of the first substrate, and a second end opposite to the first end... the buffer unit effectively reduces substrate deformation and frit unit cracking
Implementation Method 2
during the process for sintering the frit units with laser, the energy absorbed by the frit units is differed due to the scanning time of laser and the thermal conductivity of the frit units
Implementation Method 3
the energy absorbed by the frit units is differed due to the scanning time of laser and the thermal conductivity of the frit units
Implementation Method 4
when the melt frit units solidified and shrunk, the stress applied on the substrates may remain in the region corresponding to the sintering path and a heat affected zone close to the sintering path
Data Source
AI summary
An organic light emitting diode display panel is disclosed, which comprises: a first substrate having a first edge, a second edge, a third edge opposite to the first edge, and a fourth edge opposite to the second edge; a second substrate opposite to the first substrate; an organic light emitting diode unit disposed on the second substrate; a fit unit disposed between the first substrate and the second substrate and surrounding the organic light emitting diode unit; and a buffer unit disposed between the first substrate and the second substrate and between the frit unit facing to the first edge of the first substrate and the first edge thereof, wherein the buffer unit has a first end with a first cutting edge connecting to the second edge. In addition, the present invention also provides a method for manufacturing the same.