OLED Buffer Strip with Uneven Surface for Encapsulation Overflow

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Solution Overview

Problem

Existing OLED display panels face challenges in completely covering the organic buffer layer with inorganic barrier layers, leading to water and oxygen infiltration through the sides, as the boundary control for the organic buffer layer is not perfect, causing the organic layer to overflow in the encapsulation structure.

Innovation Solution

The implementation of a buffer strip with an uneven three-dimensional surface structure and a sealing layer comprising multiple barrier layers, including inorganic thin films and organic films, with hydrophobic buffer layers having high water contact angles, to effectively confine the organic buffer layer and prevent overflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a sandwich structure of inorganic barrier layer/organic buffer layer/inorganic barrier layer is used to block water and oxygen from sides, then water and oxygen blocking performance is improved, but the organic buffer layer overflows and cannot be completely covered

Engineering Contradiction:
Improvewater and oxygen blocking performanceVSAvoidboundary control of organic buffer layer
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The invention introduces a vertical height dimension by forming the buffer strip with a thickness greater than the organic buffer layer thickness. This dimensional difference creates a physical barrier that confines the organic buffer layer within the buffer strip boundaries, preventing overflow onto the display region while maintaining complete coverage by the inorganic barrier layers.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The buffer strip is formed with locally differentiated properties: it has a greater thickness than the organic buffer layer in the edge region, creating a confined space that prevents organic layer overflow. This local structural variation allows the organic buffer layer to be completely covered by inorganic barrier layers without requiring perfect boundary control during manufacturing.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the organic buffer layer is made thinner to improve boundary control, then overflow is reduced, but water and oxygen blocking performance deteriorates

Engineering Contradiction:
Improveboundary controlVSAvoidwater and oxygen blocking performance
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

Instead of reducing the organic buffer layer thickness (which would compromise blocking performance), the invention adds a vertical dimension to the buffer strip structure. The buffer strip thickness is made greater than the organic buffer layer thickness, creating a confined space that prevents overflow while allowing the organic buffer layer to maintain its adequate thickness for water and oxygen blocking.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If additional barrier walls are added to prevent organic layer overflow, then encapsulation reliability is improved, but device complexity increases

Engineering Contradiction:
Improveencapsulation reliabilityVSAvoidencapsulation structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention merges the buffer strip function with the encapsulation structure by forming the buffer strip as an integral part of the edge region structure. The buffer strip serves dual purposes: it confines the organic buffer layer preventing overflow, and it provides a platform for the inorganic barrier layers to completely cover the organic buffer layer, eliminating the need for separate additional barrier walls.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The buffer strip is designed with multi-functionality: it acts as a physical barrier to confine the organic buffer layer, serves as a structural platform for the inorganic barrier layers, and enables complete coverage of the organic buffer layer without requiring additional specialized barrier wall structures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution ensures the organic buffer layer is completely confined within the buffer strip, eliminating the need for additional barrier walls and enhancing the encapsulation structure's water and oxygen blocking performance, thereby improving the packaging and protection of OLED display panels.

Implementation Method 1

the first barrier layer directly covering the display region and the buffer strip, and a second barrier layer over the first barrier layer... the first barrier layer is an inorganic thin film... the second barrier layer is an organic film

Methodology Applied
Scientific EffectPermeation barrier: Permeation

Implementation Method 2

hydrophobic buffer layers having high water contact angles, to effectively confine the organic buffer layer and prevent overflow

Methodology Applied
Scientific EffectHydrophobic effect: Hydrophobe

Data Source

PatentUS11404666B2Organic light emitting diode display panel and manufacturing method thereof
Publication Date: 2022.08.02 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US11404666B2 patent drawing
  • US11404666B2 patent drawing
  • US11404666B2 patent drawing

AI summary

The present invention provides an organic light emitting diode (OLED) display panel and a manufacturing method thereof. The display panel includes a display structure and an encapsulation structure, the display structure includes a display region and an edged non-display region surrounding the display region, the display region includes an OLED layer, the encapsulation structure is disposed on the edged non-display region; wherein the encapsulation structure includes a buffer strip connected to the display region and a sealing layer covering the display region and the buffer strip; wherein a surface of the buffer strip has an uneven three-dimensional structure.