OLED Data Pad Electrode Adhesion via Insulating Pattern Holes

The patent applies local quality by forming protrusions on the lower surface of the insulating film at specific contact hole regions. These protrusions are localized structural modifications that enhance adhesion only where needed (at contact holes) without affecting the overall insulating film structure. The protrusions create increased surface area and mechanical interlocking with the underlying pad electrodes, solving the peeling problem locally while maintaining the protective function globally.

The patent implements preliminary action by forming the protrusions on the insulating film before the final assembly and bonding processes. This pre-formed structural feature ensures that when the insulating film is later bonded to underlying layers, the adhesion is already optimized through the protrusion geometry. The protrusions are prepared in advance to prevent peeling during subsequent manufacturing steps and device operation.

The patent introduces protrusions at specific locations on the lower surface of the insulating film corresponding to contact hole regions. These localized protrusions create mechanical interlocking features that enhance adhesion without requiring the insulating film to be completely removed or restructured. The protrusions are formed by selective etching or deposition processes that modify only the necessary areas.

The patent solves the adhesion problem by transitioning from a two-dimensional planar contact interface to a three-dimensional protrusion structure. The protrusions extend vertically from the insulating film lower surface, creating additional surface area and mechanical interlocking capability. This dimensional change allows the insulating film to maintain its protective coverage while achieving stronger bonding through the protrusion geometry.