Display Device Heat Dissipation Layers for OLED Lifespan
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Solution Overview
Problem
The efficiency and lifespan of light emitting elements in display devices, such as OLEDs, are compromised due to heat generation and accumulation, which affects their performance over time.
Innovation Solution
A display device design incorporating an inner heat dissipation layer and an external heat dissipation layer, where the inner heat dissipation layer is positioned under the light emitting element and the external heat dissipation layer is connected to it through holes in the substrate, effectively dissipating heat generated by the light emitting element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the light emitting element operates continuously, then the display device can maintain image output, but heat accumulates and deteriorates efficiency and lifespan
Solution Approach 1:
The patent converts the harmful heat generated by the light emitting element into a manageable thermal flow by designing heat dissipation pathways. The heat, which would otherwise deteriorate the light emitting element, is now directed through the first substrate to the heat dissipation structure, transforming a harmful byproduct into a controlled thermal management process that maintains continuous operation capability while protecting component lifespan.
Solution Approach 2:
The first substrate serves as an intermediary between the light emitting element and the external environment. It provides a thermal conduction pathway that mediates heat transfer from the light emitting element to the heat dissipation structure, enabling effective thermal management without compromising the operational integrity of the display device.
2Device complexity
If heat is retained within the light emitting element, then the device structure remains simple, but efficiency and lifespan deteriorate due to heat accumulation
Solution Approach 1:
The first substrate performs multiple functions: it serves as the structural base for mounting the light emitting element and simultaneously acts as a heat dissipation pathway. This multi-functionality allows the patent to implement effective heat management without adding separate complex heat dissipation components, thereby maintaining structural simplicity while improving light emitting element reliability.
3Temperature
If an external heat dissipation layer is added to improve heat dissipation, then heat emission efficiency increases, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the heat dissipation function with the existing first substrate structure. By forming the heat dissipation structure as an integral part of or in direct thermal contact with the substrate that already exists in the device architecture, the patent achieves improved heat emission efficiency without significantly increasing manufacturing complexity. The heat dissipation structure is formed using the same substrate material and integration process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces heat retention within the light emitting element, enhancing its efficiency and lifespan by allowing for efficient heat emission outside the device.
Implementation Method 1
an inner heat dissipation layer disposed below the light emitting element
Implementation Method 2
an external heat dissipation layer connected to the inner heat dissipation layer
Implementation Method 3
allowing for efficient heat emission outside the device
Data Source
AI summary
A display device according to an embodiment includes: a first substrate; a transistor disposed on the first substrate; a light emitting element electrically connected to the transistor; an inner heat dissipation layer disposed below the light emitting element; and an external heat dissipation layer connected to the inner heat dissipation layer.