OLED Display Panel Concave-Convex Encapsulation for Narrow Frame
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Solution Overview
Problem
Existing OLED display panels have a large frame due to the need for through holes in the thin film encapsulation layer, which can compromise the encapsulation and increase the size of the display panel.
Innovation Solution
A display panel design featuring a concave-convex outline for both the second electrode and the thin film encapsulation layer, where the through holes for electrical connections do not penetrate through the encapsulation layer, ensuring reliable encapsulation and a narrower frame by positioning the holes within the concave portions of the encapsulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are formed outside the thin film encapsulation layer to connect the touch electrode layer with metal wires, then electrical connection is achieved, but the frame size increases
Solution Approach 1:
The patent applies nesting by positioning the second through holes within the projection area of the thin film encapsulation layer, allowing the touch electrode connections to be nested within the encapsulation structure rather than extending outside it. This enables the frame to be reduced while maintaining encapsulation integrity.
Solution Approach 2:
The patent changes the spatial arrangement by moving the second through holes from a position outside the encapsulation layer to a position within its projection area. This dimensional repositioning allows the holes to pass through the encapsulation layer at strategic locations, reducing the frame size while maintaining electrical connectivity.
2Ease of operation
If through holes penetrate through the thin film encapsulation layer to connect the touch electrode layer with metal wires, then electrical connection is achieved, but encapsulation reliability deteriorates
Solution Approach 1:
The patent applies local quality by creating a concave-convex outline structure where the thin film encapsulation layer has localized recesses (concave portions) at specific positions. The second through holes are positioned to align with these recesses, allowing penetration at these localized areas while maintaining intact encapsulation in other regions. This selective penetration maintains overall encapsulation reliability while enabling electrical connectivity.
3Length of stationary object
If the frame size is reduced by positioning through holes within the encapsulation layer projection, then frame width decreases, but encapsulation integrity may be compromised
Solution Approach 1:
The patent creates localized recesses in the thin film encapsulation layer at specific positions, forming a concave-convex outline. These recesses are strategically positioned to accommodate the second through holes, allowing the holes to pass through at these localized areas while the rest of the encapsulation layer remains intact and provides continuous protection.
Solution Approach 2:
The patent nests the second through holes within the projection area of the thin film encapsulation layer, specifically positioning them within the concave portions of the concave-convex outline. This nesting arrangement allows the through holes to be contained within the encapsulation structure's footprint, reducing frame width while maintaining encapsulation integrity through the recess design.
Data Source
AI summary
A display panel and a display device are provided. The display device includes an array substrate; an organic light emitting layer including a second electrode; a thin film encapsulation layer cladding the organic light emitting layer; a touch electrode. A projection on the array substrate of part of a border of the second electrode/thin film encapsulation layer has a concave-convex outline. The concave-convex outline includes convex portions and concave portions. The convex portions of the second electrode are electrically connected with first metal wires in the array substrate via first through holes. Perpendicular projections on the array substrate of the second through holes are not overlapped with that on the array substrate of the thin film encapsulation layer; the perpendicular projections on the array substrate of at least part of the second through holes are in that on the array substrate of the concave portions of the thin film encapsulation layer.