OLED Edge Encapsulation Barrier Layer Bonding
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Solution Overview
Problem
Conventional thin film encapsulation processes for flexible OLED displays suffer from reduced water and oxygen resistance at the edge regions due to particle issues, leading to reduced reliability and shorter device lifetimes.
Innovation Solution
A method involving the formation of a pre-formed, ring-shaped barrier layer made of inorganic materials like silicon nitride or aluminum oxide, using low temperature plasma enhanced chemical vapor deposition, which is bonded to the edge region of the encapsulation film through rolling or vacuum bonding processes to enhance moisture and oxygen resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mask is used in the conventional thin film encapsulation process, then the inorganic layer can be formed with water and oxygen resistance, but particle problems occur in the edge region reducing reliability
Solution Approach 1:
The patent removes the mask from the encapsulation process entirely. Instead of using a mask to define the encapsulation area, the process directly forms the inorganic encapsulation layer across the entire OLED surface, eliminating mask-related particle contamination in edge regions while maintaining water and oxygen resistance
Solution Approach 2:
The patent applies a preliminary organic protective layer before forming the inorganic encapsulation layer. This organic layer serves as a foundation that prevents particle contamination during the inorganic layer formation process and ensures complete coverage including edge regions, thereby improving manufacturing precision without compromising reliability
2Ease of manufacture
If a mask is used in the encapsulation process, then the inorganic layer can be formed, but the lifetime of the OLED device is reduced due to particle problems
Solution Approach 1:
By removing the mask from the process, the patent eliminates the source of particle contamination that reduces device lifetime. The maskless approach maintains ease of manufacture through direct deposition while preventing particle-induced degradation that would otherwise shorten OLED lifetime
Solution Approach 2:
The preliminary organic protective layer is formed before the inorganic encapsulation layer to prevent particle contamination during manufacturing. This preliminary action ensures that no particles are introduced that would compromise device lifetime, while the overall process remains easy to manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the water and oxygen resistance of the edge regions, thereby enhancing the reliability and extending the lifespan of OLED devices by ensuring better encapsulation.
Implementation Method 1
forming the barrier layer by a low temperature plasma enhanced chemical vapor deposition
Implementation Method 2
bonding a barrier layer to an edge region of the at least an encapsulation film... the barrier layer is pre-formed... for blocking moisture and oxygen
Data Source
AI summary
An encapsulation method of an organic light emitting diode (OLED) device is provided. The encapsulation method includes steps of a substrate formed with the OLED device; forming at least an encapsulation film on a surface of the OLED device; and bonding a pre-formed barrier layer to an edge region of the encapsulation film. By bonding the pre-formed barrier layer to the edge region of the encapsulation film, the disclosure can achieve effects of improving an ability of moisture and oxygen resistance of the edge region of the OLED device, thereby improving reliability of encapsulation of the OLED device and prolonging lifetime of the OLED device.