OLED Encapsulation Cavity Prevents Wiring Short Circuits
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Solution Overview
Problem
Organic light-emitting display devices are prone to appearance defects due to short circuits and decolorization of the polarizing plate caused by contact between power supply wiring units during the bonding of substrates, leading to potential short circuits and heat generation.
Innovation Solution
The design includes a lower substrate with power supply wiring units in a non-display area and an encapsulation substrate with a cavity formed over the power supply wiring units, preventing direct contact and decolorization by maintaining a separation between the first and second power supply wiring units, and using a polarizing plate on the encapsulation substrate to prevent reflection and defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If power supply wiring units are disposed close to each other to reduce device area, then area is reduced, but short circuit risk increases
Solution Approach 1:
The power supply wiring units are segmented into first and second power supply wiring units that are disposed in different regions (display area and non-display area respectively), preventing direct contact while maintaining compact overall device area. This spatial segmentation resolves the contradiction by allowing close proximity without direct contact.
Solution Approach 2:
A sealing element is introduced as an intermediary component between the first and second power supply wiring units. This sealing element prevents direct contact between the wiring units, eliminating short circuit risk while allowing the device to maintain a compact form factor with reduced area.
2Length of stationary object
If substrates are bonded closely to reduce thickness, then thickness is reduced, but decolorization of polarizing plate occurs
Solution Approach 1:
A sealing element is introduced as an intermediary component between the substrates at the bonding region. This sealing element maintains an appropriate distance between the substrates in the non-display area, preventing heat transfer that causes decolorization of the polarizing plate, while still allowing thin overall device structure through selective bonding in the display area.
Solution Approach 2:
The bonding structure is designed with local quality differentiation: the display area allows close substrate bonding for thinness, while the non-display area maintains distance through sealing elements to prevent decolorization. This localized approach resolves the contradiction by applying different bonding strategies to different regions.
3Reliability
If power supply wiring units are separated to prevent short circuits, then reliability is improved, but device area increases
Solution Approach 1:
The power supply wiring units are segmented and disposed in different functional areas (display area and non-display area), achieving separation for reliability while utilizing otherwise wasted non-display space to minimize overall device area increase.
Solution Approach 2:
Instead of separating wiring units in the planar dimension which would increase area, the invention utilizes the vertical dimension by disposing wiring units in different layers (first wiring in display area, second wiring in non-display area), achieving separation without significant area penalty.
Data Source
AI summary
An organic light-emitting display device and a method of manufacturing the same are disclosed. The organic light-emitting display device includes: a lower substrate including a display area and a non-display area, the lower substrate further including a power supply wiring unit disposed in the non-display area, the power supply wiring unit including at least one power supply wiring extending along an edge of the display area; an encapsulation substrate having an outer surface and an inner surface facing the lower substrate; a cavity formed into the inner surface of the encapsulation substrate in a region over the power supply wiring unit such that the cavity overlaps at least part of the power supply wiring when viewed in a direction perpendicular to the outer surface of the encapsulation substrate; and a polarizing plate disposed on the outer surface of the encapsulation substrate.