OLED Encapsulation Colloid Patterning for Fixture-Free Manufacturing
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Solution Overview
Problem
The existing OLED display panel manufacturing methods, particularly face seal technology, face challenges in reducing equipment costs and process complexity, with high requirements for laminator size compatibility and the need for additional fixtures like carrier fixtures, which complicate the manufacturing process and lower alignment precision.
Innovation Solution
The method involves patterning the encapsulation colloid into target areas corresponding to OLED substrate units and a gap area, performing disintegration treatment on the gap area to reduce adhesiveness, and then attaching and cutting the encapsulation colloid to obtain OLED display panels, potentially using particle beam bombardment, UV irradiation, or laser scanning for patterning, and attaching in a vacuum environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If face seal technology is used with multiple panels on a high-generation glass substrate, then productivity is improved, but device complexity increases due to the need for carrier fixtures and manipulators
Solution Approach 1:
The patent extracts and removes the carrier fixture from the manufacturing process. Instead of using a carrier fixture to hold multiple encapsulants, the method directly bonds encapsulants to the OLED substrate in sequence, eliminating the need for this intermediate carrying device and simplifying the overall system.
Solution Approach 2:
The patent merges the functions of the carrier fixture and manipulator into a single direct bonding operation. The manipulator that would normally place encapsulants on a carrier fixture now directly bonds them to the OLED substrate, combining multiple steps into one integrated process.
2Ease of operation
If carrier fixtures are used to hold laminated encapsulants, then ease of operation is improved, but manufacturing precision deteriorates due to alignment difficulties
Solution Approach 1:
The patent removes the carrier fixture from the process, eliminating the intermediate transfer step that causes alignment errors. By bonding encapsulants directly to the OLED substrate, the system achieves better alignment precision while maintaining ease of operation through automated direct placement.
3Ease of operation
If additional fixtures like carrier fixtures are used, then ease of operation is improved, but loss of time increases due to extra transport and cleaning steps
Solution Approach 1:
The patent extracts the carrier fixture and its associated transport and cleaning operations from the manufacturing process. By bonding encapsulants directly to the OLED substrate, the method eliminates the time-consuming steps of placing encapsulants on a carrier, transporting the carrier, and cleaning it after use.
Solution Approach 2:
The patent enables continuous bonding of encapsulants to the OLED substrate without interruption for carrier exchange or cleaning. The manipulator can continuously place and bond encapsulants in sequence, maintaining uninterrupted productive action throughout the manufacturing process.
4Adaptability or versatility
If laminator size compatibility requirements are increased to accommodate different product sizes, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent introduces dynamic adjustability to the laminator system, enabling it to adapt to different encapsulant and OLED substrate size combinations. This dynamic capability allows the same equipment to handle various product sizes without requiring multiple specialized devices, balancing adaptability with manageable complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces the need for extra fixtures, lowers production costs, and improves alignment accuracy, facilitating automated production of OLED display panels.
Implementation Method 1
specifically, dividing the encapsulation colloid into a plurality of target encapsulation areas, with each target encapsulation area corresponding to each of the plurality of OLED substrate units, and a gap area outside of the target encapsulation areas, performing disintegration treatment on a portion of the encapsulation colloid belonging to the gap area so that the surface of the portion losing adhesiveness
Implementation Method 2
potentially using particle beam bombardment, UV irradiation, or laser scanning for patterning
Implementation Method 3
attaching in a vacuum environment
Data Source
AI summary
A manufacturing method for OLED display panel is disclosed, which first performs patterning on the encapsulation colloid of the encapsulant to divide encapsulation colloid into a plurality of target encapsulation areas, with each target encapsulation area corresponding to each OLED substrate unit, and a gap area outside of target encapsulation areas, performing disintegration treatment from the other side of encapsulation colloid on a portion of encapsulation colloid belonging to gap area so that the surface losing adhesiveness, then attaches encapsulation colloid to OLED substrate, and finally, obtains a plurality of OLED display panels by cutting. This method is simple to perform, reduces the size compatibility requirement of the laminator and avoids the use of extra manipulator and carrier fixture, which reduces the product cost incurred by fixture cleaning, transport, storage and other complex operations, and improves the product of the alignment accuracy, is good for automated production.


