OLED Encapsulation Grooves for Moisture Barrier
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Solution Overview
Problem
Organic light emitting display devices are prone to damage from oxygen and moisture, which affects their reliability and durability.
Innovation Solution
A display panel structure is designed with a base substrate, an organic light emitting device, and an encapsulation member, featuring module holes, blocking grooves, and inorganic and organic layers to prevent oxygen and moisture infiltration, with specific layer configurations and distances to enhance protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the organic light emitting device is provided with a simple structure, then the manufacturing cost is reduced, but the device is easily damaged by oxygen or moisture
Solution Approach 1:
The encapsulation structure is divided into multiple functional components: a base substrate providing structural support, an organic light emitting device layer, and a multi-layer encapsulation member with blocking grooves. This segmentation allows each layer to perform its specific function (structural support, light emission, and barrier protection) independently, achieving reliable protection without requiring a monolithic complex structure.
Solution Approach 2:
The encapsulation member is nested within the display panel structure, with the organic light emitting device positioned on the base substrate and the encapsulation member covering the device. The blocking grooves are nested within the encapsulation member, creating a hierarchical protection system where each nested element contributes to the overall barrier function against oxygen and moisture.
2Strength
If the base substrate is made thicker to improve structural strength, then the durability is enhanced, but the distance for contaminant penetration increases
Solution Approach 1:
Instead of uniformly increasing the base substrate thickness across the entire structure, the patent implements localized barrier features through blocking grooves in the encapsulation member. These grooves create local discontinuities that block contaminant penetration paths without requiring increased substrate thickness, thereby maintaining structural strength while reducing the effective penetration distance for harmful factors.
Solution Approach 2:
The patent addresses the penetration issue by introducing a vertical dimension feature through the blocking grooves that extend into the encapsulation member. This creates a three-dimensional barrier structure that blocks contaminant paths without increasing the horizontal footprint or requiring a thicker base substrate, effectively reducing the penetration distance in the vertical dimension.
3Reliability
If the encapsulation member is made more extensive to improve protection, then the reliability is enhanced, but the manufacturing complexity increases
Solution Approach 1:
The encapsulation member is segmented into distinct functional zones: regions with blocking grooves for enhanced barrier protection and regions without grooves for simplified manufacturing. This segmentation allows the complex protected areas to provide reliable contamination barriers while the simpler regions maintain ease of manufacture, balancing reliability and manufacturability.
Solution Approach 2:
The blocking grooves are implemented locally in specific regions of the encapsulation member rather than uniformly across the entire structure. This local quality approach provides enhanced protection where most needed (over the organic light emitting device) while maintaining simpler, easier-to-manufacture structures in other areas, thereby balancing reliability enhancement with manufacturing ease.
Data Source
AI summary
A display device may include a base substrate including display and peripheral regions adjacent to each other, an organic light emitting device, and an encapsulation member. A module hole, a first blocking groove, and a second blocking groove may be defined in the base substrate. The module hole may be defined in the display region to penetrate the base substrate from a front surface to a rear surface. The first and second blocking grooves may be provided to enclose the module hole. A distance from the rear surface of the base substrate to a top surface of the encapsulation member between the first and second blocking grooves is smaller than that in a region outside the second blocking groove.