OLED Display Panel Fan-Out Line Arrangement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional OLED display panel manufacturing faces encapsulating failure and reliability issues due to overlapping regions between data fan-out lines and power supply fan-out lines with the encapsulating region, leading to broken data fan-out lines.
Innovation Solution
The display panel design includes a substrate with a step region where data fan-out lines and power supply fan-out lines are arranged such that their overlapping regions with the encapsulating area do not overlap orthographically, ensuring non-interference and preventing encapsulating failure, along with a method for manufacturing this panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If data fan-out lines and power supply fan-out line are arranged in conventional overlapping configuration with encapsulating region, then manufacturing process is simplified, but encapsulating failure occurs and data fan-out lines become easily broken
Solution Approach 1:
The patent applies dimensional separation by arranging data fan-out lines and power supply fan-out lines in different spatial regions relative to the encapsulating region. Specifically, data fan-out lines are positioned to overlap with a first region of the encapsulating region while power supply fan-out lines overlap with a second region, ensuring their overlapping projections do not coincide. This spatial redistribution in the projection plane eliminates the harmful triple overlap while maintaining manufacturing feasibility.
Solution Approach 2:
The encapsulating region is segmented into multiple distinct overlapping regions - a first overlapping region for data fan-out lines and a second overlapping region for power supply fan-out lines. This segmentation prevents the formation of a common overlapping region where all three elements (data fan-out line, power supply fan-out line, and encapsulating region) would intersect, thereby eliminating the root cause of encapsulating failure and line breakage.
2Device complexity
If data fan-out line and power supply fan-out line share common overlapping region with encapsulating region, then routing complexity is reduced, but stress concentration occurs causing line breakage
Solution Approach 1:
The patent redistributes the routing paths of data fan-out lines and power supply fan-out lines in the projection plane to different overlapping regions of the encapsulating region. This spatial separation in the two-dimensional projection eliminates the concentration of stress at a single common overlapping point, thereby preventing line breakage while maintaining reasonable routing complexity.
Data Source
AI summary
An electronic device, a display panel, and a method for manufacturing the display panel are provided. The display panel includes a substrate, and data fan-out lines and a power supply fan-out line arranged in a step region of the substrate. An orthographic projection of an overlapping region between the power supply fan-out line and the encapsulating region on the substrate is non-overlapping with an orthographic projection of an overlapping region between each of the data fan-out lines and the encapsulating region on the substrate, thereby reducing the encapsulating failure of the sealant due to a common overlapping region of the data fan-out lines and the power supply fan-out line in the encapsulating region, and improving the reliability of the display panel.