OLED Encapsulation Using Frame Glue and Thin Film Layers
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Solution Overview
Problem
Traditional OLED encapsulation methods, such as cover packaging and laser packaging, are ineffective for flexible OLEDs due to increased thickness and weight, while thin film encapsulation faces challenges with incomplete coverage and complex manufacturing processes.
Innovation Solution
An OLED encapsulation method combining frame glue and thin film encapsulation technologies, where frame glue limits the organic layer's dimension, allowing complete coverage by inorganic layers, and using the same mask for inorganic layer deposition to reduce manufacturing complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional encapsulation technology (cover packaging or laser packaging) is used, then water and oxygen blocking effectiveness is improved, but device thickness and weight increase
Solution Approach 1:
The patent uses thin film encapsulation with alternating inorganic and organic layers to replace traditional thick encapsulation structures. The inorganic layers (silicon nitride, silicon oxide, or aluminum oxide) provide water and oxygen blocking, while the organic layers fill pinholes and release stress, achieving effective encapsulation with reduced thickness and weight suitable for flexible OLED displays
2Reliability
If thin film encapsulation with inorganic layers is used, then water and oxygen blocking is improved, but pinholes and particles are generated during manufacturing
Solution Approach 1:
The patent employs composite encapsulation structure with alternating inorganic and organic layers. The inorganic layers provide water and oxygen blocking, while the organic layers serve to fill pinholes and particles generated during inorganic layer deposition, and release stress between layers to prevent defects, achieving both effective blocking and high manufacturing precision
3Reliability
If inorganic layer dimension is increased to cover organic layer completely, then encapsulation completeness is improved, but manufacturing process complexity increases due to multiple masks
Solution Approach 1:
The patent applies frame glue around the OLED component before depositing inorganic layers. This preliminary action defines the deposition area, allowing inorganic layers to be deposited completely covering the organic layers using a single mask, thus achieving encapsulation completeness while reducing manufacturing process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances encapsulation effectiveness by ensuring complete coverage of organic layers and reduces manufacturing costs by minimizing the number of masks required.
Implementation Method 1
The inorganic layer is mainly made by silicon nitride, silicon oxide or aluminum oxide, and may effectively block the water and oxygen
Implementation Method 2
The organic layer also can release the stress between the inorganic layer, which contributes to flattening
Implementation Method 3
coating frame glue or Dam & Fill, which is curable by ultraviolet (UV) rays
Data Source
AI summary
The present disclosure relates to an OLED encapsulation method and an OLED encapsulation structure. The OLED encapsulation method combines the frame glue encapsulation technology and the thin film encapsulation technology. By adopting the frame glue to block the organic layer and to limit the dimension of the organic layer, each of the organic layers can be completely covered by the inorganic layer arranged thereon. At the same time, the inorganic layers may be manufactured by the same mask, which reduces the number of the mask so as to reduce the cost. The OLED encapsulation structure combines the frame glue encapsulation technology and the thin film encapsulation technology. By adopting the frame glue to block the organic layer and to limit the dimension of the organic layer, each of the organic layers can be completely covered by the inorganic layer arranged thereon. At the same time, the inorganic layers may be manufactured by the same mask, which reduces the number of the mask so as to reduce the cost.