OLED Encapsulation Structure Using Laser-Melted Frit Barricade
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Solution Overview
Problem
OLED devices are susceptible to water vapor and oxygen gas, which lead to chemical reactions and malfunction, necessitating an effective encapsulation method to prevent gas permeation and extend device lifespan.
Innovation Solution
An encapsulation structure comprising a glass substrate with a recessed portion, a glass cover plate bonded with a frit barricade of melted glass powders, and a sealing layer, forming a closed cavity that prevents water vapor and oxygen gas from entering, using a laser packaging method to integrate the glass components and enclose the OLED device and sealing layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional encapsulation methods are used, then the OLED device can be sealed, but water vapor and oxygen gas can still permeate into the device, leading to chemical reactions and malfunction
Solution Approach 1:
The patent employs a composite encapsulation structure consisting of a glass substrate, glass cover plate, and frit barricade (melted glass powders). This composite material system creates a hermetic seal that effectively prevents water vapor and oxygen gas permeation, resolving the issue of gas penetration through traditional encapsulation methods.
Solution Approach 2:
The patent replaces traditional mechanical sealing methods with a laser-based packaging method. The laser head is controlled to scan along glass powder, melting it to form a hermetic seal. This substitution of mechanical sealing with laser-induced melting achieves superior gas barrier properties.
2Duration of action of stationary object
If a hermetic seal is formed to prevent gas permeation, then the service life is extended, but the manufacturing process becomes more complex
Solution Approach 1:
The patent replaces complex multi-step mechanical sealing processes with a laser packaging method. The laser head is controlled to scan along glass powder, melting it in place to form a hermetic seal. This reduces manufacturing complexity while achieving superior hermetic sealing for extended service life.
Solution Approach 2:
The patent utilizes laser parameters (energy, duration, scanning speed) to control the melting and bonding of glass powders. By adjusting these parameters, the process achieves hermetic sealing with controlled precision, simplifying the overall manufacturing process while ensuring long-term reliability.
3Strength
If glass powders are used to form a frit barricade, then the bonding strength between glass cover plate and substrate is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent uses laser scanning to melt glass powders with high precision control. The laser head is controlled to scan along the glass powder, providing precise energy delivery that ensures accurate bonding positions. This replaces less precise mechanical bonding methods while achieving superior bonding strength.
Solution Approach 2:
The patent controls laser parameters (power, scanning speed, pulse duration) to precisely melt glass powders at specific locations. This parameter control enables accurate positioning and consistent bonding strength, meeting high manufacturing precision requirements while ensuring strong adhesion between the glass cover plate and substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents water vapor and oxygen gas from entering the OLED device, thereby prolonging its service life and maintaining display quality without affecting light emission efficiency.
Implementation Method 1
bonding the glass substrate and the glass cover plate into an integral structure by using a laser packaging method in which a laser head is controlled to scan along glass powder to let the glass powder melt
Implementation Method 2
The periphery of the glass cover plate and the glass substrate are bonded through a frit barricade formed by melted glass powders, so that the glass cover plate and the glass substrate have an integral structure, and a closed cavity is formed
Data Source
AI summary
An encapsulation structure for OLED device comprises a glass substrate, a glass cover plate, an OLED device and a sealing layer. The glass substrate has a recessed portion, the glass cover plate is located at an opening of the recessed portion, and a periphery of the glass cover plate and the glass substrate are bonded through a frit barricade formed by melted glass powders, so that the glass cover plate and the glass substrate have an integral structure, a closed cavity is formed by the glass cover plate and the recessed portion, and both the OLED device and the sealing layer are located within the closed cavity. With the above encapsulation structure, water vapor and oxygen gas can be prevented from entering the OLED device, and service life of the OLED device is prolonged. There is further disclosed an encapsulating method.