OLED Frit Sintering for Circular and Irregular Shapes
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Solution Overview
Problem
Conventional frit packaging methods for OLED devices can only produce rectangular structures, limiting the shape versatility of products and failing to meet the needs of wearable products with circular, elliptic, or irregular shapes.
Innovation Solution
A sintering method that defines a closed pattern with at least one arcuate section, allowing the substance to be sintered along a circular, elliptic, or irregular shape by moving the energy beam in a first and second rectilinear direction, enabling the production of products with various shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional frit packaging sintering path is used, then rectangular structure products can be produced, but shape versatility is limited
Solution Approach 1:
The sintering path is changed from a fixed rectangular trajectory to a dynamic closed pattern that can be programmed to follow circular, elliptic, or irregular shapes. The energy beam moves flexibly along predefined closed patterns, allowing the same sintering equipment to produce various shapes by simply changing the path program, thereby improving shape versatility without requiring different manufacturing equipment
Solution Approach 2:
The invention changes the sintering path parameters from rectangular coordinates to closed pattern coordinates. By modifying the path definition parameters (from straight lines and right angles to curved lines and variable angles), the system can produce different shapes using the same fundamental sintering process, resolving the contradiction between versatility and manufacturing simplicity
2Reliability
If frit packaging is used for OLED devices, then water vapor permeability is reduced (10−6/m3/day), but product shape is restricted to rectangular
Solution Approach 1:
The sintering process is segmented into multiple sections along the closed pattern, including arcuate sections with angles greater than 90 degrees. This segmentation allows the energy beam to systematically process each portion of the frit material along the desired shape, ensuring complete sintering while achieving non-rectangular product shapes with the same reliable water vapor barrier performance
3Adaptability or versatility
If closed pattern sintering is implemented, then various shaped products (circular, elliptic, irregular) can be produced, but sintering path planning becomes more complex
Solution Approach 1:
The sintering system is designed with universal closed pattern capability that can handle multiple shapes (circular, elliptic, irregular) using the same basic process framework. The energy beam system maintains its fundamental sintering function while adapting to different closed patterns through programming, achieving multi-functionality without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the production of OLED devices with circular, elliptic, or irregular shapes, addressing the limitation of rectangular structures and fulfilling customer needs for diverse product shapes, thereby boosting the OLED industry's development.
Implementation Method 1
sintering the substance along the closed pattern in a first rectilinear direction, and finishing the laser sintering in a second rectilinear direction
Data Source
AI summary
A sintering method includes defining a closed pattern having at least one arcuate section. A substance is applied on a substrate along the closed pattern and is sintered along the closed pattern in a first rectilinear direction. The sintering is finished in a second rectilinear direction along the closed pattern. A display device packaging method includes defining a closed pattern having at least one arcuate section. Frit is applied on a substrate of a display device along the closed pattern. A cover plate is provided on the substrate. The frit is sintered along the closed pattern. The sintering is finished in a second rectilinear direction. Then, the cover plate and the substrate of the display device are packaged.