OLED Lighting Heat Dissipating Wire Thermal Management
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Solution Overview
Problem
OLED lighting apparatuses face inefficiencies in heat dissipation due to insulation substrates with low thermal conductivity, leading to reduced lifespan and durability.
Innovation Solution
Incorporating a heat dissipating wire with a heat absorption portion, a heat dissipating portion, and a coupling portion, using materials like metals, metal oxides, graphite, and silicon, and embedding conductive particulates in the sealant to enhance heat transfer and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If insulation substrates with low thermal conductivity are used, then the structural simplicity and insulation properties are maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The substrate is divided into two functional parts: an insulation substrate for structural support and electrical insulation, and a separate heat dissipating wire for thermal management. This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
The heat dissipating wire acts as an intermediary element between the OLED and the environment. It absorbs heat from the OLED through thermal conduction and dissipates it to the surroundings, mediating the thermal management function while preserving the insulation substrate's properties.
2Reliability
If insulation substrates with low thermal conductivity are used, then electrical insulation is maintained, but lifespan and durability deteriorate due to heat accumulation
Solution Approach 1:
The substrate system is segmented into electrical insulation function (handled by insulation substrate) and thermal management function (handled by heat dissipating wire), allowing simultaneous optimization of both reliability and lifespan.
Solution Approach 2:
The heat dissipating wire serves as a thermal intermediary that protects the OLED from heat accumulation by conducting heat away, thereby extending device lifespan while the insulation substrate maintains electrical insulation for reliability.
3Temperature
If heat dissipating wire is added, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipating wire performs multiple functions: it conducts heat from the OLED, provides a thermal pathway to the environment, and can serve as a structural element within the device assembly. This multi-functionality minimizes the increase in overall device complexity.
Solution Approach 2:
The thermal conductivity parameter of the substrate system is enhanced by introducing the heat dissipating wire with high thermal conductivity material, changing the thermal parameters without fundamentally altering the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively radiates heat generated by OLEDs, suppressing degradation and improving the lifespan and durability of OLED lighting apparatuses by enhancing heat dissipation efficiency.
Implementation Method 1
a heat dissipating wire 400 having a heat absorption portion 401 disposed on one side of the encapsulation substrate 200, which faces the sealant 300
Implementation Method 2
a heat dissipating portion 403 disposed on an opposite side of the one side, and a coupling portion 402 for connecting the absorption portion 401 and the heat dissipating portion 403
Implementation Method 3
The sealant 300 may include a heat transfer material. The heat transfer material may be a conductive particulate.
Data Source
AI summary
An organic light emitting diode (OLED) lighting apparatus is disclosed. In one embodiment, the apparatus includes i) a substrate main body including a light emitting area and a sealing area surrounding the light emitting area, ii) an OLED disposed on the light emitting area of the substrate main body, iii) a sealant disposed on the sealing area of the substrate main body and iv) an encapsulation substrate encapsulating the OLED, wherein the encapsulation substrate comprises first and second surfaces opposing each other. The apparatus may further include a heat dissipating wire configured to dissipate heat generated by the OLED. The heat dissipating wire includes a heat absorption portion disposed on the first surface of the encapsulation substrate and contacting the sealant, a heat dissipating portion disposed on the second surface, and a coupling portion interconnecting the absorption portion and the heat dissipating portion.