OLED Display Hole Formation with Laser Protection Layer
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Solution Overview
Problem
Existing methods for forming holes in OLED device structures for camera installation in mobile phone screens result in metal warpages and residues, leading to encapsulation failures and reduced product lifespan due to incomplete coverage by inorganic encapsulation layers.
Innovation Solution
A display panel design featuring a laser protection layer on the periphery of the electroluminescent device layer, which is formed using a glass encapsulation material and cured to provide mechanical strength, preventing metal warpages during hole formation and ensuring effective sealing by the encapsulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a laser is used to cut the OLED device structure to form a hole, then the hole can be formed for camera installation, but metal warpages and residues are generated leading to encapsulation failures
Solution Approach 1:
The laser protection layer is formed on the electroluminescent device layer before the laser cutting process. This preliminary protective layer prevents direct laser interaction with the metal cathode, avoiding metal warpages and residues that cause encapsulation failures. The protection layer is subsequently removed after hole formation, completing the protective function.
Solution Approach 2:
The laser protection layer acts as an intermediary substance between the laser beam and the metal cathode layer. It absorbs or deflects the laser energy, preventing the laser from directly heating and deforming the metal cathode. This mediator layer ensures clean hole edges without metal residues, enabling successful encapsulation.
2Reliability
If the laser protection layer is made thicker to better suppress metal warpages, then the protection effect is improved, but the device structure becomes more complex and manufacturing difficulty increases
Solution Approach 1:
The thickness of the laser protection layer is optimized within a specific range (2-10 microns) to achieve the best balance between protection effectiveness and manufacturing simplicity. This parameter optimization ensures sufficient protection against metal warpages while maintaining ease of formation and removal, avoiding excessive structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses metal warpages and enhances the sealing effect of the encapsulation layer, improving the packaging and lifespan of the display panel by ensuring complete coverage and preventing encapsulation failures.
Implementation Method 1
curing the glass encapsulation material by heating at a heating temperature of 80°-120° and a heating time of 5-30 minutes
Implementation Method 2
cutting, by using a laser, the electroluminescent device layer along an hole edge of the hole of the laser protection layer to form a hole in the electroluminescent device layer
Data Source
AI summary
A display panel is provided which comprises a substrate, a backboard, and an electroluminescent device layer, which are stacked in sequence, the electroluminescent device layer having a hole at a display region of the display panel, a laser protection layer is provided on a periphery of the hole of the electroluminescent device layer.