OLED Display Encapsulation Using Homogeneous Films and Moisture Absorbent
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Organic light emitting diode display devices face reliability issues due to warpage caused by differences in thermal expansion coefficients between the cover film and bottom film, and poor humidity resistance from the use of materials with low resistance to moisture.
Innovation Solution
The use of a cover film and bottom film made of the same material, with a moisture absorbent placed between the bottom film and the flexible substrate, and the inclusion of a barrier layer on the surfaces of the films to prevent moisture and oxygen infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cover film and bottom film are used with different materials to provide encapsulation, then moisture protection is achieved, but warpage occurs due to different coefficients of thermal expansion
Solution Approach 1:
The patent applies homogeneity by using the same material for both the cover film and bottom film. This ensures that both films have identical coefficients of thermal expansion, preventing warpage while maintaining moisture protection. The encapsulation structure achieves uniform thermal expansion characteristics across both films, resolving the contradiction between moisture protection and structural stability.
2Strength
If the bottom film and optically clear adhesive are used to attach the bottom film to the flexible substrate, then structural integrity is achieved, but humidity resistance deteriorates due to poor resistance to moisture
Solution Approach 1:
The patent applies composite materials by combining the bottom film made of a moisture-resistant material with a moisture absorbent layer. This composite structure maintains structural integrity while significantly improving humidity resistance. The bottom film provides mechanical strength and the moisture absorbent layer provides enhanced moisture barrier properties, resolving the contradiction between structural integrity and humidity resistance.
3Reliability
If a moisture absorbent is added between the bottom film and the flexible substrate, then moisture resistance is improved, but device complexity increases
Solution Approach 1:
The patent applies merging by integrating the moisture absorbent function directly into the bottom film structure. The moisture absorbent layer is combined with the bottom film to form a unified encapsulation layer, achieving enhanced moisture resistance without significantly increasing device complexity. This integrated approach maintains structural simplicity while improving moisture protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the organic light emitting diode display device by preventing warpage and improving moisture resistance, thereby maintaining the device's performance and longevity.
Implementation Method 1
a moisture absorbent is formed between the bottom film and the flexible substrate
Data Source
AI summary
An organic light emitting diode display device is disclosed. The organic light emitting diode display device includes an organic light emitting diode array formed on a flexible substrate, a cover film formed to cover the organic light emitting diode array, and a bottom film attached to a lower surface of the flexible substrate. Reliability of the organic light emitting diode display device may be improved by forming a cover film attached to the organic light emitting diode array and a bottom film attached to the lower surface of the flexible substrate on which the organic light emitting diode array is formed using the same material, and forming a moisture absorbent on the bottom film.