Laser Packaging of OLED Substrates Using Pre-heating
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Solution Overview
Problem
Current OLED device packaging methods face challenges due to the high temperature difference between glass substrates and laser beams, which can cause glass substrates to rupture, affecting the sealing process and reducing the service life of OLED devices.
Innovation Solution
A laser packaging method where the substrates are pre-heated on a warm water circulating heating platform to a temperature between 25°C and 150°C before laser irradiation, reducing the temperature difference and preventing substrate rupture, while using a glass frit with a low melting point to form a seal between the substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser beam is used to melt glass frit for sealing, then sealing efficiency is improved, but glass base substrate may rupture due to high temperature difference
Solution Approach 1:
The patent applies preliminary action by pre-heating the glass base substrate to a temperature of 25°C to 150°C before laser irradiation. This pre-heating step reduces the temperature difference between the substrate and the laser beam, preventing thermal shock and substrate rupture while maintaining the sealing efficiency benefits of laser heating.
2Temperature
If high temperature laser beam is used for packaging, then glass frit melting is achieved, but temperature difference causes substrate damage
Solution Approach 1:
The patent applies parameter changes by modifying the temperature parameter of the glass base substrate before laser processing. By pre-heating the substrate to 25°C-150°C, the temperature difference parameter between substrate and laser beam is reduced, eliminating thermal shock while maintaining the high temperature necessary for glass frit melting.
3Loss of time
If glass frit is heated directly by laser beam, then sealing is formed quickly, but substrate rupture occurs due to large temperature difference
Solution Approach 1:
The patent applies preliminary action by pre-heating the substrate before laser processing. This preliminary heating step prevents substrate rupture during laser-induced glass frit melting, ensuring packaging quality is maintained while the process remains efficient and quick.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents substrate rupture and enhances the packaging process, improving the sealing efficiency and extending the service life of OLED devices by maintaining a controlled temperature during the sealing process.
Implementation Method 1
pre-heating the first substrate and the second substrate which are cell-assembled by the heating platform
Implementation Method 2
the glass frit is heated by moving laser beam, to melt the glass frit
Implementation Method 3
laser emitted from laser beam has very high temperature (usually between 350° C. and 500° C.)
Implementation Method 4
the heating platform is a heating platform of warm water circulating type
Data Source
AI summary
A laser packaging method and a manufacturing method of a display panel are provided. The laser packaging method includes placing a first substrate (2) on a platform (1), and arranging a glass frit in a packaging region of the first substrate (2); cell-assembling a second substrate (3) and the first substrate (2); and pre-heating the first substrate (2) and the second substrate (3) which are cell-assembled.