OLED Manufacturing Anti-Moisture Layer Laser Removal
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Solution Overview
Problem
The manufacturing process of organic light emitting display devices is hindered by the need for a mask to form anti-moisture insulation layers, leading to reduced uniformity, layer-forming defects, high costs due to expensive alignment systems and equipment, and increased PECVD chamber volume.
Innovation Solution
A method that forms an anti-moisture insulation layer entirely covering the substrate without a mask, using a laser to selectively remove the layer at pad contact portions, thereby eliminating the need for a separate deposition mask and enhancing process efficiency and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is used to prevent anti-moisture insulation layer formation in non-display portions, then the insulation layer can be selectively formed, but manufacturing cost increases due to expensive alignment systems and equipment
Solution Approach 1:
The patent extracts and removes the mask from the manufacturing process entirely. Instead of using a mask to prevent insulation layer formation in non-display portions, the process forms the insulation layer across the entire substrate and then selectively removes it from non-display portions using laser processing. This eliminates the need for expensive mask alignment systems and equipment.
Solution Approach 2:
The patent inverts the traditional approach by doing the opposite of what is conventionally done. Instead of preventing insulation layer formation where not needed (using a mask), the process forms the insulation layer everywhere and then removes it where not needed (using laser). This inversion eliminates mask-related costs while achieving the same selective formation result.
2Manufacturing precision
If a mask is used to form the anti-moisture insulation layer, then selective formation is achieved, but layer-forming defects occur due to partial detachment or misalignment of the mask
Solution Approach 1:
The patent extracts the mask from the manufacturing process, eliminating all defects associated with mask detachment and misalignment. The insulation layer is formed without any mask, ensuring complete reliability and absence of mask-related layer-forming defects.
3Manufacturing precision
If a mask is used in the PECVD process, then selective insulation layer formation is achieved, but the PECVD chamber volume increases and additional equipment is needed
Solution Approach 1:
The patent removes the mask from the PECVD process, eliminating the need for mask handling equipment and reducing the PECVD chamber volume requirements. The insulation layer is formed across the entire substrate without any mask, simplifying the equipment configuration.
Solution Approach 2:
The patent inverts the selective formation approach by forming the insulation layer across the entire substrate and then using laser processing to remove it from non-display portions. This inversion eliminates the need for mask-related equipment and reduces PECVD chamber complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, enhances the uniformity of the anti-moisture insulation layer, and eliminates defects caused by mask misalignment, while maintaining protection against moisture and oxygen.
Implementation Method 1
removing the anti-moisture insulation layer, at the pad contact portion, using a laser
Data Source
AI summary
Provided is a method of manufacturing an organic light emitting display device. The method includes: providing a first substrate including: a display portion, and a non-display portion, forming a thin film transistor (TFT) and an organic light emitting diode (OLED) in the display portion of the first substrate, providing a pad portion including: at least one pad contact portion at the non-display portion and electrically connected to the TFT, and a pad insulating portion between adjacent pad contact portions, providing an anti-moisture insulation layer entirely covering the first substrate, adhering an encapsulating substrate onto the anti-moisture insulation portion in correspondence with the display portion, and removing the anti-moisture insulation layer, at the pad contact portion, using a laser.