OLED Display Panel Metal Wiring Coverage in Bending Areas
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Solution Overview
Problem
In OLED display devices, the organic deep hole material forms a step difference with the interlayer dielectric layer when filled and patterned, leading to poor coverage of metal lines in the bending area, causing stress concentration and abnormalities like holes and breaks.
Innovation Solution
A display panel design with a flexible substrate, an inorganic film layer, a filling layer protruding from the interlayer dielectric layer, and a protective layer made of inorganic material covering the filling layer, which reduces stress concentration and improves metal wiring coverage by preventing damage from hydrofluoric acid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If organic deep hole material is filled into the deep hole of pad bending and patterned, then the metal lines can be formed, but the organic deep hole material forms a step difference with the interlayer dielectric layer causing poor coverage of metal lines at the corners
Solution Approach 1:
The patent introduces an inorganic protective layer as an intermediary between the organic deep hole material and the metal lines. This protective layer has better etch resistance to HF than the organic material, preventing the step difference from causing poor coverage. The protective layer acts as a mediator that protects the organic material's edge during metal line formation, ensuring complete coverage at the corners.
2Reliability
If metal lines in the pad bending are pre-cleaned with hydrofluoric acid before film formation, then the metal lines can be properly prepared, but the hydrofluoric acid damages the interlayer dielectric layer and increases the slope angle at the edge of the organic deep hole material
Solution Approach 1:
The inorganic protective layer serves as a mediator that protects the organic deep hole material from HF damage during the metal line pre-cleaning process. The protective layer has higher etch resistance to HF compared to the organic material, allowing the HF treatment to proceed without significantly damaging the organic material's edge, thus maintaining better coverage.
Solution Approach 2:
The protective layer is formed beforehand on the organic deep hole material, providing a cushioning protection before the HF pre-cleaning process. This prior protection prevents the HF from directly attacking and damaging the organic material's edge, reducing the slope angle increase and maintaining better coverage.
3Ease of manufacture
If the organic deep hole material has a taper when filled, then the deep hole can be properly filled, but it forms a step difference with the interlayer dielectric layer leading to stress concentration
Solution Approach 1:
The inorganic protective layer acts as an intermediary that compensates for the step difference created by the tapered organic deep hole material. By providing an additional layer with better etch resistance, it reduces the stress concentration at the edge where the organic material meets the interlayer dielectric layer, preventing holes and breaks in the metal lines.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective layer enhances the coverage of metal wirings at the edges of the organic film layer, reducing abnormalities such as holes and breaks, and improves the reliability of the display panel.
Implementation Method 1
a protective layer covering a portion of the filling layer... preventing damage from hydrofluoric acid
Data Source
AI summary
The invention discloses a display panel, a fabricating method thereof, and a display device. The display panel improves the covering structure of the metal wirings in the bending area, thereby improving the problem of poor coverage of metal wirings caused by stress concentration at the corners of the organic film layer in the bending area, and further reducing abnormalities such as holes and breaks in metal wirings.