OLED Package Structure with Annular Groove and Segmented Adhesive
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Solution Overview
Problem
The existing OLED package structures using frit as packaging adhesive face challenges in achieving optimal sealing and uniform spacer thickness, leading to issues like unwanted evaporation material and Newton ring effects, which affect display quality.
Innovation Solution
An OLED package structure with an annular groove on the cover plate and a packaging adhesive that extends both inside and outside the groove, allowing for a thinner spacer and improved sealing, preventing unwanted evaporation and Newton ring phenomena.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the spacer is made thinner to avoid unwanted evaporation material, then the display quality is improved, but the sealing reliability deteriorates
Solution Approach 1:
The packaging adhesive is segmented into two distinct regions: a first region that fills the groove and provides sealing, and a second region that extends outside the groove and provides mechanical bonding. This segmentation allows each region to optimize its function independently, resolving the contradiction between thin spacer requirements and sealing reliability.
Solution Approach 2:
Different regions of the packaging adhesive are given different thicknesses and functions. The first region (inside groove) has thickness optimized for sealing against the cover plate, while the second region (outside groove) has thickness optimized for bonding to the substrate. This local differentiation resolves the contradiction by allowing the spacer to be thin overall while maintaining sealing reliability in critical areas.
2Reliability
If the frit packaging adhesive is made thicker to ensure packaging requirements, then the sealing reliability is improved, but the cover plate warping occurs causing Newton ring effects
Solution Approach 1:
The packaging adhesive is divided into a first region within the groove and a second region outside the groove. The first region provides the necessary sealing thickness without causing excessive overall thickness that would warp the cover plate, while the second region provides additional bonding strength. This segmentation resolves the contradiction between sealing reliability and cover plate flatness.
Solution Approach 2:
The solution moves from a uniform one-dimensional thickness approach to a two-dimensional distributed thickness approach. By placing adhesive both inside and outside the groove, the system achieves the required sealing function without increasing the maximum thickness anywhere, thereby preventing cover plate warping and Newton ring effects.
3Ease of manufacture
If a uniform thickness packaging adhesive is used, then the manufacturing process is simplified, but both sealing reliability and bonding strength cannot be simultaneously optimized
Solution Approach 1:
The packaging adhesive structure is segmented into a first region for sealing and a second region for bonding, with each region having optimized thickness. This segmentation allows the manufacturing process to apply adhesive in a systematic two-step manner (filling groove then adding external layer), which is more reliable than uniform thickness while remaining manufacturable.
Solution Approach 2:
The thickness parameter of the packaging adhesive is changed from a uniform value to a spatially varying distribution. The first region has thickness optimized for sealing (filling the groove), while the second region has thickness optimized for bonding (extending outside). This parameter change enables simultaneous optimization of both sealing reliability and bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures a uniform distance between the cover plate and substrate, reducing unwanted evaporation material and preventing image quality issues like poor color mixture and Newton rings, while maintaining effective sealing.
Implementation Method 1
the frit is heated and melted by using a moving laser beam
Implementation Method 2
the frit is heated and melted by using a moving laser beam
Data Source
AI summary
An OLED package structure includes: a substrate, on which an organic light-emitting element is provided, and a cover plate having an annular groove surrounding the organic light-emitting element thereon. A packaging adhesive, partly inside the groove and partly outside the groove, adheres the cover plate to the substrate to seal the organic light-emitting element. In the OLED package structure according to the present invention, the thickness of the spacer can be smaller, so as to eliminate color mixture during an evaporation process and to prevent a Newton ring phenomenon in the OLED package structure.