OLED Package Plate Grooves for Bubble-Free Underfill
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Solution Overview
Problem
The existing Dam & Fill package method for OLEDs often results in bubbles during the lamination process due to the low viscosity of the underfill, which cannot be effectively eliminated, affecting the performance and lifetime of OLED elements.
Innovation Solution
A package method involving a package plate with grooves and recesses in the spreading surface, allowing for air extraction between the substrate and package plate, and using UV glue and liquid transparent underfill to form a frame that prevents bubble formation during lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If underfill is dispensed drop by drop with low viscosity to fill the area surrounded by the inner glue frame, then the underfill can spread to fill the gap, but bubbles form among the droplets that are hard to eliminate
Solution Approach 1:
The patent applies preliminary action by forming grooves on the package plate before dispensing the underfill. These grooves guide the underfill flow and prevent bubble formation from the outset, rather than attempting to remove bubbles after they form. The grooves are prepared in advance to control the filling process and ensure complete coverage without trapping air.
Solution Approach 2:
The patent utilizes the porous or channel-like structure of the grooves formed on the package plate to facilitate air escape during the underfill dispensing process. The grooves act as pathways that allow trapped air to escape while the underfill fills the gaps, thereby preventing bubble formation and ensuring complete filling of the encapsulation area.
2Ease of operation
If the underfill viscosity is kept low for easy spreading, then the underfill fills the gap effectively, but bubbles are trapped and cannot be eliminated
Solution Approach 1:
The patent applies local quality by creating grooves with specific local structures on the package plate where the underfill is dispensed. The grooves provide localized pathways for air escape while maintaining the low viscosity characteristics of the underfill for easy spreading. This local structural modification enables both easy spreading and bubble-free filling simultaneously.
3Stability of the object's composition
If the inner and outer glue frames are used to restrict the underfill area, then the package structure is stable, but bubbles among the underfill droplets cannot be eliminated
Solution Approach 1:
The patent applies segmentation by dividing the encapsulation area into specific zones using grooves on the package plate. The grooves segment the underfill flow path into controlled channels, allowing the underfill to spread systematically while preventing bubble entrapment. This segmented approach maintains the structural stability provided by the glue frames while improving filling completeness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a bubble-free package, improving the performance and extending the lifetime of OLED elements by allowing for complete filling and sealing of the underfill within the frame, thus enhancing the package result.
Implementation Method 1
an UV light is utilized to irradiate the seal glue and the underfill and solidify both
Data Source
AI summary
A package structure includes a substrate and a package plate. A frame is formed of a seal glue arranged between the substrate and the package plate. An underfill is positioned inboard of the frame. The package plate has a spreading surface, and at least one groove is formed in a spreading path of the frame on the spreading surface of the package plate.