OLED Package Structure with Inorganic Frame and Resin Film
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional frit-based laser packaging processes for OLED devices are inadequate for large-sized panels due to insufficient mechanical strength and vulnerability to moisture and oxygen, which can lead to electrochemical corrosion and thermal radiation damage.
Innovation Solution
An OLED package structure featuring a substrate, a package lid with a trough, a solid resin film covering the OLED device, an inorganic protective frame made of silicon nitride, and fritted glass outside the frame, bonded using adhesive and laser irradiation to enhance moisture and oxygen blocking, mechanical strength, and thermal protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If frit based laser packaging process is used, then moisture and oxygen blocking capability is improved, but mechanical strength is insufficient for large-sized panels
Solution Approach 1:
The packaging structure is divided into multiple functional layers: a solid resin film layer that provides mechanical strength and structural support, and a fritted glass layer that provides moisture and oxygen blocking capability. This segmentation allows each layer to specialize in its respective function, resolving the contradiction between mechanical strength and sealing performance.
Solution Approach 2:
The invention uses a composite packaging structure combining organic solid resin material and inorganic fritted glass material. The solid resin provides mechanical strength and flexibility, while the fritted glass provides excellent moisture and oxygen barrier properties. This composite approach allows both requirements to be met simultaneously.
2Duration of action of stationary object
If frit based laser packaging process is used, then lifespan is extended, but thermal radiation causes burning of light emission element
Solution Approach 1:
The solid resin film acts as an intermediary layer between the OLED device and the fritted glass. During laser sintering of the fritted glass, this resin layer absorbs and dissipates thermal radiation, preventing direct thermal damage to the light emission element while still allowing the fritted glass to provide its moisture and oxygen blocking function.
Solution Approach 2:
The solid resin film is applied beforehand to cover the OLED device before the fritted glass is sintered. This pre-positioned protective layer cushions the OLED against thermal radiation during the packaging process, preventing burning while maintaining the longevity benefits of the fritted glass sealing.
3Area of stationary object
If large-sized OLED display panel is packaged, then area is increased, but gap size increases reducing mechanical strength
Solution Approach 1:
The solid resin film forms a flexible protective layer that can conform to large panel areas while maintaining structural integrity. This thin film provides continuous coverage across the entire OLED surface, distributing mechanical stresses evenly and maintaining strength even as panel size increases and cavity gaps become larger.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved air tightness, mechanical strength, and thermal protection, extending the lifespan of OLED devices and making them suitable for large-sized panels while maintaining ease of operation.
Implementation Method 1
A laser is then applied to instantaneously heat the fritted glass 300 to melt thereby adhering the two glass sheets together
Implementation Method 2
adhesive applied on the package lid to bond the inorganic protective frame and the package lid to each other
Data Source
AI summary
An OLED packaging method includes providing a substrate on which an OLED device is formed and a package lid that comprises a trough formed to correspond to the OLED device and receive a solid resin film therein, forming a loop of fritted glass on the package lid and outside the trough, forming a loop of inorganic protective frame made of silicon nitride on the substrate and at a location that is outside the trough and inside the fritted glass, forming a loop of adhesive on the package lid to correspond to the inorganic protective frame, and laminating the package lid and the substrate to each other such that the OLED device is covered by the solid resin film and the inorganic protective frame is adhered to the adhesive to form a combined circumferential wall, which surrounds, together with the fritted glass, the OLED device covered by the solid resin film.