OLED Package Structure Using Organic Layer as Planarization and Photo Mask
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Solution Overview
Problem
Current flexible display packaging methods require additional planarization layers and metal mask plates, leading to increased complexity, non-uniform film thickness, and difficulty in achieving a narrow bezel due to the need for multiple mask processes and potential damage from chemical vapor deposition.
Innovation Solution
A package structure and manufacturing method that uses an additional organic layer as both a planarization layer and a photo mask layer to etch the package stack, eliminating the need for a metal mask plate and additional planarization layers, thereby simplifying the process and preventing non-uniform film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an additional planarization layer and metal mask plate are used in the packaging process, then the package structure can be formed, but the manufacturing complexity increases and the film thickness becomes non-uniform
Solution Approach 1:
The patent combines the planarization layer and photo mask layer into a single additional layer. This layer serves dual functions: providing surface planarization for subsequent processing and acting as a photo mask for etching the package stack. This merging eliminates the need for a separate metal mask plate and reduces the number of manufacturing steps, thereby simplifying the process while maintaining uniform film thickness.
Solution Approach 2:
The additional layer is designed to perform multiple functions simultaneously: it acts as a planarization layer to flatten the surface, serves as a photo mask layer for pattern transfer during etching, and provides structural support. This multi-functionality reduces the overall number of layers and components needed, simplifying the manufacturing process while ensuring precise control over film thickness uniformity.
2Length of moving object
If multiple mask processes are used to achieve a narrow bezel, then the bezel width can be reduced, but the manufacturing complexity and potential damage from chemical vapor deposition increase
Solution Approach 1:
The patent merges the planarization function and photo mask function into a single additional layer, eliminating the need for multiple separate mask processes. This single integrated layer enables precise pattern definition for narrow bezel formation while reducing the number of deposition and etching cycles, thereby minimizing exposure to potential damage from repeated chemical vapor deposition processes.
Solution Approach 2:
The additional layer is formed beforehand to serve as both the planarization surface and the photo mask for subsequent etching. This preliminary preparation allows for precise control of the bezel width in a single etching step, avoiding the need for multiple iterative mask processes and reducing the overall complexity of the manufacturing sequence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexity, eliminates the need for additional mask processes, and allows for a narrower bezel by using the additional layer as both a planarization and photo mask layer, enhancing the package effect and reducing the risk of damage during processing.
Implementation Method 1
etching the package stack with the additional layer as a photo mask layer to remove portions of the package stack not covered by the additional layer
Implementation Method 2
The inorganic layer is formed by using plasma enhanced chemical vapor deposition, atomic layer deposition or sputter deposition
Implementation Method 3
The inorganic layer is formed by using plasma enhanced chemical vapor deposition, atomic layer deposition or sputter deposition
Data Source
AI summary
A package structure and a manufacturing method thereof, and a display panel are provided, and the package structure comprises a package stack disposed on a substrate; and an additional layer disposed on the package stack. The package structure provided by the present disclosure results in saving of one deposition process and one mask process, thereby the manufacturing process is simplified. Moreover, a narrow bezel may be realized.