OLED Panel Cutting Method for Slim Bezel Design
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Solution Overview
Problem
Conventional methods for manufacturing OLED panels struggle to further reduce the width of the bezel region while ensuring the reliability of the final product, as decreasing the bezel width or frit package region width can lead to defects and compromised reliability.
Innovation Solution
A method involving the cutting of an OLED motherboard within the frit package region, at a specific distance from the edge, using a cutting wheel with controlled speed and preheating the frit by laser to ensure precise cutting and encapsulation, thereby achieving a slim bezel design without compromising reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the width of the frit package region is decreased to achieve a slim bezel design, then the aesthetic effect and cost are improved, but the reliability of the OLED panel is compromised due to process limitations
Solution Approach 1:
The patent applies preliminary action by preheating the frit material along the cutting line before cutting. This preheating process softens the frit, allowing for cleaner separation and reducing the risk of defects. By performing this preparatory step, the patent enables cutting closer to the display region while maintaining encapsulation integrity and panel reliability
Solution Approach 2:
The patent replaces conventional mechanical cutting methods with a combination of laser preheating and cutting. The laser provides localized thermal energy to soften the frit material, making it more amenable to clean separation. This substitution of thermal-mechanical process for purely mechanical cutting enables precise control and reduces defects, allowing for narrower bezel widths without compromising reliability
2Manufacturing precision
If conventional cutting methods are used on the OLED motherboard, then the manufacturing process is simple, but the cutting precision is insufficient and defects occur
Solution Approach 1:
The patent applies preliminary action by preheating the frit material along the cutting line before cutting. This preheating process softens the frit, allowing for cleaner separation and reducing the risk of defects. By performing this preparatory step, the patent enables cutting closer to the display region while maintaining encapsulation integrity and panel reliability
Solution Approach 2:
The patent replaces conventional mechanical cutting methods with a combination of laser preheating and cutting. The laser provides localized thermal energy to soften the frit material, making it more amenable to clean separation. This substitution of thermal-mechanical process for purely mechanical cutting enables precise control and reduces defects, allowing for narrower bezel widths without compromising reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively decreases the bezel region dimensions, enhances cutting precision, and maintains the reliability of the OLED panel by optimizing the cutting line placement and preheating process, ensuring successful package properties and reduced defects.
Implementation Method 1
preheating the frit by laser
Implementation Method 2
preheating the frit along the cutting line
Data Source
AI summary
A method for manufacturing an OLED panel is provided by embodiments of the present disclosure, including following steps of: manufacturing an OLED motherboard which comprises a plurality of OLED panel areas spaced apart from one another, each comprising a display region and a frit package region which is located on a periphery of the display region and is to encapsulate the display region by a frit; and cutting the OLED motherboard along a cutting line to obtain separated OLED panels; and the cutting line is located within the frit package region and at a predetermined distance inwards from an edge of the periphery of the frit package region.