OLED Thin Film Encapsulation with Patterned Thermal Layer
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Solution Overview
Problem
Current OLED display packaging techniques struggle with heat-induced thermal decomposition and inadequate moisture and oxygen blocking, particularly in flexible devices, due to poor thermal conductivity materials like inorganic metal oxides and organic layers.
Innovation Solution
A thin film encapsulation structure with a patterned high thermal conductivity layer, comprising materials like diamond-like carbon, silver, aluminum, aluminum nitride, or copper, is integrated into the OLED display, featuring openings that correspond to sub-pixel areas to facilitate effective heat transfer without light absorption, combined with inorganic and organic passivation layers for moisture and oxygen blocking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic metal oxide layers and organic layers are used for thin film encapsulation, then moisture and oxygen blocking is achieved, but thermal conductivity is poor causing heat-induced decomposition
Solution Approach 1:
The patent uses composite materials by combining inorganic layers (Al2O3, SiO2) with organic layers (polymer materials) to create a multi-layer thin film encapsulation structure. This composite approach allows the inorganic layers to provide moisture and oxygen blocking while the organic layers provide thermal conductivity pathways, resolving the contradiction between blocking performance and heat dissipation.
Solution Approach 2:
The patent applies local quality by creating regions with different thermal conductivities within the encapsulation structure. The organic layers are strategically positioned to provide thermal conduction pathways in specific areas, while inorganic layers provide blocking functions in other regions, allowing simultaneous optimization of both moisture blocking and heat dissipation.
2Temperature
If copper heat dissipation plate is added to improve heat transfer, then operation temperature is reduced, but transmission rate is not high enough for top emission devices
Solution Approach 1:
The patent extracts the heat dissipation function from a solid copper plate and redistributes it through thin organic layers integrated within the encapsulation structure. This extraction allows heat dissipation to occur through multiple distributed pathways rather than requiring a single opaque copper layer, maintaining light transmission while achieving thermal management.
Solution Approach 2:
The patent uses thin film organic layers instead of thick copper plates for heat dissipation. These thin films provide sufficient thermal conductivity while maintaining high light transmission rates, enabling top emission device functionality while still achieving effective heat management.
3Reliability
If silver layer is added to reduce water vapor transmission rate, then WVTR is reduced to 10^-5 g/m2/d, but heat transfer is improved, however covering Ag on entire surface reduces outward emission of light
Solution Approach 1:
The patent segments the encapsulation structure into multiple functional layers rather than using a single continuous silver layer. The inorganic and organic layers are arranged in alternating sequences, with each layer performing specific functions (blocking, thermal conduction, stress relief). This segmentation allows light to pass through transparent organic and inorganic layers while still achieving effective moisture blocking through the inorganic barriers.
Solution Approach 2:
The patent introduces organic layers as intermediary materials between the inorganic blocking layers. These organic intermediaries provide thermal conduction pathways and maintain structural integrity while allowing light transmission, mediating between the conflicting requirements of moisture blocking and light emission.
4Stability of the object's composition
If alternating inorganic and organic layers are used, then stress relief and planarization are achieved, but thermal conductivity remains poor
Solution Approach 1:
The patent changes the thermal conductivity parameter of the encapsulation structure by selecting organic materials with higher thermal conductivity and optimizing their thickness and distribution within the multi-layer structure. This parameter optimization allows the alternating layer structure to maintain its stress relief function while improving overall thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation, reduces thermal decomposition, and extends the service life of OLED devices while maintaining light emission efficiency and effective moisture and oxygen blocking.
Implementation Method 1
a high thermal conductivity layer disposed on the first inorganic passivation layer
Implementation Method 2
the inorganic layers function to block external moisture and oxygen
Implementation Method 3
the organic layers function for relief of stress and planarization covering of particulate substances
Data Source
AI summary
The present invention provides an OLED display and a manufacturing method thereof. The OLED display of the present invention includes an OLED substrate and a thin film encapsulation layer disposed on the OLED substrate. The thin film encapsulation layer includes a patterned the high thermal conductivity layer and the high thermal conductivity layer is provided with a plurality of openings formed therein to correspond, in a one to one manner, to a plurality of sub-pixel areas of the OLED substrate so as to prevent the high thermal conductivity layer from absorbing light and also help eliminate the constraint that a top emission device is only allowed to use a material having a high transmission rate, thereby allowing for effective transfer of heat generated during an operation of an OLED device without deteriorating light emission efficiency of the device, reducing thermal decomposition of a material of the OLED device, and ensuring the device possesses sufficiency capability of blocking external moisture and oxygen to thus extend the service life of the device.