OLED Encapsulation Layer for Peripheral Wire Corrosion
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Solution Overview
Problem
OLED display devices are prone to corrosion of wires in the peripheral area due to moisture or salt water from a user's hand, especially in bent areas where the substrate contacts the user, leading to potential damage and malfunction.
Innovation Solution
An encapsulation layer is extended to cover the connection wires in the peripheral area, comprising alternately layered inorganic and organic layers, with a metal oxide or hexamethyldisiloxane layer, which prevents moisture and salt water from permeating and causing corrosion, while also being integrated into the manufacturing process without additional mask or deposition steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the encapsulation layer is extended to cover the connection wires in the peripheral area, then the corrosion resistance and reliability are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The encapsulation layer is extended in advance to cover the connection wires in the peripheral area before they are exposed to moisture or salt water. This preliminary protective action prevents corrosion before it can occur, addressing the reliability issue without requiring complex additional protective structures later.
Solution Approach 2:
The encapsulation layer is implemented as a thin film structure that can be extended to cover both the display area and the peripheral connection wires. This thin film approach provides effective corrosion protection while avoiding the need for bulky or complex protective structures.
2Object-affected harmful factors
If the encapsulation layer is extended to cover the connection wires, then the protection against moisture and salt water is improved, but the manufacturing time and cost increase
Solution Approach 1:
The encapsulation layer formation process is merged to simultaneously cover both the display area and the peripheral connection wires. By combining these areas into a single encapsulation process, the manufacturing time is minimized while still providing comprehensive protection against moisture and salt water permeation.
Solution Approach 2:
The encapsulation layer is designed to serve multiple functions: protecting both the display area and the peripheral connection wires against moisture and salt water. This multi-functional approach eliminates the need for separate protective structures, thereby reducing manufacturing time and complexity.
3Reliability
If the encapsulation layer is extended to the peripheral area, then the wire corrosion is prevented, but the structural complexity and deposition steps increase
Solution Approach 1:
The encapsulation layer is extended specifically to the peripheral area where connection wires are located, providing localized corrosion protection where it is most needed. This local quality approach ensures wire durability without requiring complex deposition steps across the entire device structure.
Solution Approach 2:
The encapsulation layer is formed to extend into the peripheral area during the initial deposition process, before the connection wires are assembled or connected. This preliminary action simplifies the overall manufacturing process by integrating the protective structure into the base fabrication steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents corrosion of connection wires in the peripheral area, enhancing the durability and reliability of OLED display devices by sealing the wires from moisture and salt water, thus reducing manufacturing time and costs.
Implementation Method 1
An encapsulation layer provided on the plurality of signal lines is extended and is thus provided on the plurality of connection wires
Data Source
AI summary
A display device is disclosed. In one aspect, the display device includes a substrate including a display area configured to display an image and a peripheral area surrounding the display area. The display device also includes a plurality of signal lines provided in the display area, an encapsulation layer provided over the signal lines and a pad portion provided in the peripheral area. The display device further includes a plurality of connection wires connecting the signal lines and the pad portion, wherein each of the connection wires includes a first portion provided in the peripheral area and a second portion provided in the display area. A portion of the encapsulation layer provided on the display area extends to the peripheral area and placed over the first portions of the connection wires.