Protective Bezel for OLED Thin Film Encapsulation Edge Integrity
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Solution Overview
Problem
The existing thin film encapsulation in organic light emitting diode displays is prone to deterioration due to moisture and oxygen permeation, especially in non-display areas, leading to gaps and edge tears that compromise the encapsulation effect, particularly as the non-display area width is reduced.
Innovation Solution
An organic light emitting diode display design incorporating a protective bezel with a laminated structure of inorganic and organic layers, along with a buffer part and sealant, to prevent gaps between the substrate and thin film encapsulation, and enhance the encapsulation effect by using a combination of rigid and flexible materials to surround the edges and provide elasticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the non-display area width is reduced, then the display area is increased, but the thin film encapsulation becomes more vulnerable to gaps and edge tears
Solution Approach 1:
The protective bezel is formed in advance before the thin film encapsulation process, creating a pre-established protective structure that prevents gaps and edge tears from occurring during subsequent manufacturing steps. This preliminary protective measure ensures encapsulation integrity even as the non-display area is minimized.
Solution Approach 2:
The buffer part of the protective bezel is specifically designed to absorb and cushion mechanical stresses and external impacts that occur during manufacturing processes. This beforehand cushioning prevents edge tears and gaps in the thin film encapsulation, maintaining reliability while allowing reduced non-display area.
2Reliability
If a rigid protective structure is used to protect edges, then encapsulation integrity is improved, but flexibility and adaptability are reduced
Solution Approach 1:
The protective bezel is constructed from a flexible material that can elastically deform during assembly and adapt to the substrate contours. This flexible structure maintains encapsulation integrity by providing continuous protection while accommodating manufacturing variations and external impacts, unlike rigid structures that would be brittle and inflexible.
Solution Approach 2:
The protective bezel transitions from a static rigid barrier to a dynamic flexible structure that can adapt its shape and absorb impacts. The elastic deformation capability allows the bezel to respond to external forces while maintaining protective function, combining reliability with adaptability.
3Length of moving object
If the thin film encapsulation is made thinner to reduce device thickness, then device profile is improved, but resistance to moisture and oxygen permeation is reduced
Solution Approach 1:
The protective function is segmented into two distinct components: the thin film encapsulation for space-efficient coverage and the protective bezel for enhanced barrier protection. This segmentation allows the encapsulation to remain thin for device profile while the bezel provides additional protection against moisture and oxygen permeation at the edges where penetration is most likely.
Solution Approach 2:
The flexible protective bezel acts as an additional barrier layer that complements the thin film encapsulation. Together they create a multi-layer protection system that maintains effectiveness against moisture and oxygen while keeping the overall device thickness minimal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents moisture and oxygen from permeating into the display area, reducing the risk of organic light emitting diode deterioration and maintaining the encapsulation integrity even under external impacts during manufacturing processes.
Implementation Method 1
The protective bezel may have elasticity and be assembled with the edge of the substrate by deformation and then press the substrate and the thin film encapsulation by restoring force.
Data Source
AI summary
Provided is an organic light emitting diode display including a substrate; a display unit formed on the substrate and including a thin film transistor and an organic light emitting diode; a thin film encapsulation covering and encapsulating the display unit and formed by a laminated structure made of at least one first inorganic layer, a first organic layer, and a second inorganic layer; and a protective bezel fixed to the substrate and spaced apart from the side of the substrate to surround edges of the substrate and the thin film encapsulation.