OLED Display Panel Recessed Array Layer for Flexible Encapsulation
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Solution Overview
Problem
In organic light emitting diode (OLED) display panels, the separation of the array layer and the thin film encapsulation layer during bending leads to moisture and oxygen penetration, affecting luminous performance and lifespan.
Innovation Solution
The OLED display panel features specific recesses on the array layer and corresponding protrusions on the thin film encapsulation layer, forming engaging structures that enhance physical interaction between the layers, preventing separation during bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple film layers are formed at different times in the OLED device, then the manufacturing process is simplified and each layer can be optimized independently, but the interfaces between film layers are not close enough and the layers separate during bending
Solution Approach 1:
The patent applies preliminary action by forming protrusions on the array layer before depositing the thin film encapsulation layer. These protrusions are created in advance through etching or patterning processes, and they serve as mechanical anchors that prevent interface separation during subsequent bending operations. This preliminary structural preparation ensures that when the encapsulation layer is deposited, it forms strong mechanical interlocking with the array layer, resolving the contradiction between manufacturing simplicity and interface stability.
2Adaptability or versatility
If the OLED device is bent dynamically for flexibility, then the device achieves flexible display capabilities, but the film layers separate at interfaces due to insufficient bonding
Solution Approach 1:
The patent applies dimensionality change by transitioning from a planar interface between film layers to a three-dimensional interlocking structure. The protrusions extend vertically from the array layer surface, creating a multi-dimensional engagement structure that mechanically locks the encapsulation layer in place. This vertical dimension addition provides robust resistance against delamination forces generated during bending, while still allowing the overall device to achieve flexible form factors.
3Productivity
If the interface between array layer and thin film encapsulation layer is weak, then the manufacturing process is faster and simpler, but moisture and oxygen permeate into the electroluminescent segment film affecting performance
Solution Approach 1:
The patent applies preliminary action by pre-forming protrusions on the array layer before encapsulation layer deposition. This preliminary structural preparation enables the subsequent encapsulation process to proceed quickly while simultaneously ensuring strong mechanical interlocking. The protrusions are created in advance through efficient etching or patterning, and then the encapsulation layer is deposited in a single continuous process, maintaining high productivity while achieving reliable moisture and oxygen barrier performance through the enhanced mechanical bond.
Data Source
AI summary
An organic light emitting diode display panel of the present disclosure includes a substrate, an array layer disposed on the substrate, a specific recess disposed on a surface of the array layer away from the substrate, an electroluminescent layer disposed on the array layer, and a thin film encapsulation layer disposed on the electroluminescent layer and covering the electroluminescent layer. The thin film encapsulation layer extends into the specific recess and fills the specific recess, and special structures which engage with each other are formed at a position corresponding to the specific recess.