OLED Display Panel Recessed Passivation for Sealant Adhesion
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Solution Overview
Problem
The performance and lifespan of OLED display panels are compromised due to the sensitivity of their components to water vapor and oxygen, leading to poor packaging effects and rapid degradation, as the contact area between the organic sealant and passivation layer is small, allowing easy permeation of external moisture and oxygen.
Innovation Solution
A manufacturing method for OLED display panels that involves forming recesses and via holes on the passivation layer using a single patterning process, increasing the contact area with the sealant and enhancing adhesiveness, thereby improving packaging performance and reducing moisture and oxygen penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional packaging method with direct coating of sealant on passivation layer is used, then the manufacturing process is simple, but the contact area between sealant and passivation layer is small leading to poor packaging performance
Solution Approach 1:
The passivation layer is segmented by forming multiple recesses (first recesses and second recesses) at different levels, creating a stepped structure that increases the contact area with the sealant. This segmentation allows the sealant to contact both the first passivation layer and the second passivation layer, significantly improving packaging performance without excessive complexity
Solution Approach 2:
The invention transitions from a single-plane contact structure to a multi-level stepped structure by forming recesses at different depths (first recesses in the first passivation layer and second recesses in the second passivation layer). This dimensional change increases the contact area between the sealant and passivation layer, resolving the contradiction between packaging performance and structural complexity
2Reliability
If the sealant contact area with passivation layer is increased by forming recesses, then packaging performance improves, but the manufacturing process complexity increases
Solution Approach 1:
The formation of first recesses and second recesses is combined into a single etching process step, where both types of recesses are formed simultaneously using the same etching conditions. This merging of operations improves packaging effect while minimizing the increase in manufacturing process complexity
Solution Approach 2:
The etching process is designed to perform multiple functions: it forms both the first recesses (exposing the anode) and the second recesses (exposing the gate insulating layer) in a single operation. This multi-functionality approach improves packaging performance without proportionally increasing manufacturing complexity
3Strength
If multiple recesses are formed to increase sealant contact area, then adhesiveness improves, but production time increases
Solution Approach 1:
The formation of first recesses and second recesses is merged into a single etching step with unified etching conditions, allowing both types of recesses to be formed simultaneously. This merging maintains high adhesiveness through increased contact area while minimizing the impact on production efficiency by avoiding separate etching operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the packaging effect, improves display performance, stability, and extends the lifespan of OLED display panels by increasing the adhesiveness between the sealant and passivation layer, reducing moisture and oxygen ingress, and optimizing production efficiency and cost.
Implementation Method 1
increasing the contact area with the sealant and enhancing adhesiveness
Implementation Method 2
sealed oppositely by the sealant
Data Source
AI summary
An organic light emitting diode (OLED) display panel and a manufacture method thereof, a display device are disclosed. The method includes providing a base substrate, including a display area and a package area; forming a driving transistor, a passivation layer and an OLED display unit on the base substrate, wherein the OLED display unit and the driving transistor are formed in the display area, the passivation layer is formed in both the display area and the package area and includes a plurality of recesses in the package area and a via hole in the display area, and the via hole and the plurality of recesses are formed by same one patterning process; coating a sealant in the package area to cover the plurality of recesses; and providing a package substrate, the package substrate and the base substrate being assembled together and sealed oppositely by the sealant.